SCHEMBL97727

SCHEMBL97727

CC(S)CC(=O)OCC(COC(=O)CC(C)S)OC(=O)CC(C)S

nearest known ligand 0.59

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
PRKCA P17252 5/20 0.56
ALDH1A1 P00352 1/20 0.44
LMNA P02545 1/20 0.44
PRKCE Q02156 1/20 0.38
PRKCQ Q04759 1/20 0.38
PRKCD Q05655 1/20 0.38
LPAR1 Q92633 2/20 0.36
LPAR3 Q9UBY5 2/20 0.36
ENPP2 Q13822 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4977858 0.91 PRKCA (0.51) PRKCAALDH1A1LMNAPRKCEPRKCQ
SCHEMBL2860440 0.91 PRKCA (0.70) PRKCAPRKCEPRKCQPRKCD
SCHEMBL30673065 0.84 PRKCA (0.43) PRKCAALDH1A1LMNA
SCHEMBL98666 0.84 PRKCA (0.43) PRKCAALDH1A1LMNA
SCHEMBL14415219 0.83 PRKCA (0.59) PRKCAALDH1A1LMNAPRKCEPRKCQ
SCHEMBL23225382 0.82 PRKCA (0.58) PRKCAALDH1A1LMNAPRKCEPRKCQ
SCHEMBL19300940 0.82 PRKCA (0.58) PRKCAALDH1A1LMNAPRKCEPRKCQ
SCHEMBL8843058 0.82 PRKCA (0.58) PRKCAALDH1A1LMNAPRKCEPRKCQ
SCHEMBL16857556 0.81 PRKCA (0.49) PRKCAALDH1A1LMNAPRKCEPRKCQ
SCHEMBL2859972 0.79 PRKCA (0.40) PRKCA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2436715-B1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO KK (JP) 2016-08-24 EP claimed
US-8865801-B2 Epoxy resin-based coating composition SHOWA DENKO K.K. (JP) 2014-10-21 US claimed
US-8242217-B2 Epoxy resin curing agent, process for preparing the same, and epoxy resin composition SHOWA DENKO K.K. (JP) 2012-08-14 US claimed
EP-2226347-B1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO KK (JP) 2012-06-27 EP claimed
US-20120077903-A1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO K.K. (JP) 2012-03-29 US claimed
US-20100273940-A1 EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2010-10-28 US claimed
EP-2226347-A1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION Showa Denko K.K. (JP) 2010-09-08 EP claimed
US-12492293-B2 Multi-component systems for preparing foamed products ARKEMA FRANCE (FR) 2025-12-09 US disclosed
WO-2025125563-A1 COUMARIN THIOESTER PHOTOINITIATORS ARKEMA FRANCE (FR) 2025-06-19 WO disclosed
WO-2025125561-A1 THIOESTER PHOTOINITIATORS ARKEMA FRANCE (FR) 2025-06-19 WO disclosed
EP-4570860-A1 COUMARIN THIOESTER PHOTOINITIATORS ARKEMA FRANCE (FR) 2025-06-18 EP disclosed
EP-4570791-A1 THIOESTER PHOTOINITIATORS ARKEMA FRANCE (FR) 2025-06-18 EP disclosed
CN-113444340-B Resin composition 味之素株式会社 2025-06-10 CN disclosed
EP-2226347-B1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO KK (JP) 2012-06-27 EP disclosed
US-20120157564-A1 ENERGY RAY-CURABLE ELASTOMER COMPOSITION BRIDGESTONE CORPORATION (JP) 2012-06-21 US disclosed
US-20120077903-A1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO K.K. (JP) 2012-03-29 US disclosed
EP-2426162-A1 ENERGY-RAY-CURABLE ELASTOMER COMPOSITION, MATERIAL FOR GASKET, GASKET, AND HARD DISK DEVICE Bridgestone Corporation (JP) 2012-03-07 EP disclosed
US-20120041096-A1 ENERGY-RAY-CURABLE ELASTOMER COMPOSITION, MATERIAL FOR GASKET, GASKET, AND HARD DISK DEVICE BRIDGESTONE CORPORATION (JP) 2012-02-16 US disclosed
US-20100273940-A1 EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2010-10-28 US disclosed
EP-2226347-A1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION Showa Denko K.K. (JP) 2010-09-08 EP disclosed