SCHEMBL28620541

SCHEMBL28620541

Nc1c(O)ccc(C(=O)c2cccc(O)c2)c1N

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FASN P49327 1/20 0.53
PARP1 P09874 1/20 0.50
MEN1 O00255 1/20 0.49
USP2 O75604 1/20 0.49
GAA P10253 1/20 0.49
KMT2A Q03164 1/20 0.49
KEAP1 Q14145 1/20 0.49
NFE2L2 Q16236 1/20 0.49
HSD17B1 P14061 7/20 0.48
HSD17B2 P37059 7/20 0.48
STS P08842 1/20 0.48
DYRK1A Q13627 4/20 0.47
CLK1 P49759 3/20 0.47
DYRK1B Q9Y463 3/20 0.47
CA12 O43570 1/20 0.47
CA1 P00915 1/20 0.47
CA2 P00918 1/20 0.47
CA6 P23280 1/20 0.47
CA9 Q16790 1/20 0.47
SIRT1 Q96EB6 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28350982 0.82 FASN (0.51) FASNPARP1MEN1USP2GAA
SCHEMBL29557325 0.79 HDAC1 (0.62) FASNPARP1MEN1USP2GAA
SCHEMBL351277 0.79 HDAC1 (0.62) FASNPARP1MEN1USP2GAA
SCHEMBL7713702 0.79 MEN1 (0.76) FASNPARP1MEN1USP2GAA
SCHEMBL7713698 0.79 FASN (0.59) FASNPARP1MEN1USP2GAA
SCHEMBL27887823 0.79 LIG1 (0.53) MEN1USP2GAAKMT2AKEAP1
SCHEMBL29436318 0.79 LIG1 (0.53) MEN1USP2GAAKMT2AKEAP1
SCHEMBL4014144 0.79 PARP1 (0.49) FASNPARP1MEN1GAAKMT2A
SCHEMBL35142 0.79 HSD17B1 (0.49) FASNPARP1HSD17B1HSD17B2STS
SCHEMBL7720770 0.77 FASN (0.62) FASNPARP1MEN1USP2GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109563353-B Resin composition 东丽株式会社 2022-01-14 CN disclosed
CN-109863206-B Resin composition, resin sheet, cured film, organic EL display device, semiconductor electronic component, and semiconductor device 东丽株式会社 2021-08-24 CN disclosed