SCHEMBL28624930

SCHEMBL28624930

CC(S)CC(=O)CCn1c(=O)[nH]c(=O)[nH]c1=O

nearest known ligand 0.39

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
APEX1 P27695 1/20 0.39
KDM4E B2RXH2 1/20 0.31
ALDH1A1 P00352 1/20 0.31
HPGD P15428 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16222852 0.77 GAA (0.37) KDM4EALDH1A1HPGD
SCHEMBL28348795 0.76 APEX1 (0.43) APEX1KDM4EALDH1A1HPGD
SCHEMBL4188327 0.71 APEX1 (0.70) APEX1KDM4EALDH1A1HPGD
SCHEMBL6935087 0.71 ALDH1A1 (0.35) APEX1KDM4EALDH1A1HPGD
SCHEMBL17027641 0.70 APEX1 (0.33) APEX1
SCHEMBL29252281 0.70 DAO (0.39) APEX1KDM4EALDH1A1
SCHEMBL28974261 0.69 TSHR (0.43) APEX1KDM4EALDH1A1
SCHEMBL28529521 0.69
SCHEMBL30604639 0.68 KMT2A (0.36) ALDH1A1
SCHEMBL28256924 0.67 TDP1 (0.34) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113174227-A Heat-resistant low-temperature curing epoxy adhesive 佛山禾邦新材料科技有限公司 2021-07-27 CN claimed
CN-113174227-A Heat-resistant low-temperature curing epoxy adhesive 佛山禾邦新材料科技有限公司 2021-07-27 CN disclosed