SCHEMBL28633836

SCHEMBL28633836

CC(C)(C)OOC(=O)C1(C(=O)OC(C)(C)C)CCCCC1

nearest known ligand 0.32

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.30
TSHR P16473 1/20 0.30
HSD17B10 Q99714 1/20 0.30
TDP1 Q9NUW8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9054163 0.93 ALDH1A1 (0.33) ALDH1A1TSHRHSD17B10TDP1
SCHEMBL6355124 0.89 NPSR1 (0.33) TSHR
SCHEMBL30683839 0.87 NPSR1 (0.34)
SCHEMBL22927448 0.82 DGAT1 (0.33)
SCHEMBL23293553 0.79 CYP2C19 (0.32)
SCHEMBL4825718 0.79 NPSR1 (0.42) ALDH1A1
SCHEMBL7884001 0.78 CYP2C19 (0.31)
SCHEMBL27574308 0.78 CYP4F2 (0.30)
SCHEMBL4829842 0.77 NPSR1 (0.31)
SCHEMBL15535385 0.77 DGAT1 (0.34)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117980364-A Curable organopolysiloxane composition, organopolysiloxane adhesive layer obtained by curing the same, and laminate 陶氏东丽株式会社 2024-05-03 CN disclosed
CN-117940529-A Curable organopolysiloxane composition, micro-adhesive organopolysiloxane adhesive layer obtained by curing the same, and laminate 陶氏东丽株式会社 2024-04-26 CN disclosed
CN-117940471-A Hot-melt curable polyorganosiloxane composition, cured product of the composition, and method for producing film or the like from the composition 陶氏东丽株式会社 2024-04-26 CN disclosed
CN-117916280-A Curable hot-melt silicone composition, cured product of the composition, and method for producing film or the like comprising the composition 陶氏东丽株式会社 2024-04-19 CN disclosed
CN-113631660-B Curable silicone composition, cured product thereof, and method for producing same 陶氏东丽株式会社 2023-07-07 CN disclosed
CN-113631659-B Curable silicone composition, cured product thereof, and method for producing same 陶氏东丽株式会社 2023-05-05 CN disclosed
CN-113614174-B Curable silicone composition, cured product thereof, and method for producing same 陶氏东丽株式会社 2023-04-04 CN disclosed
CN-113396188-B Curable silicone composition for transfer molding, cured product thereof, and method for producing same 陶氏东丽株式会社 2023-01-17 CN disclosed
CN-113330071-B Curable silicone composition, cured product thereof, and method for producing same 陶氏东丽株式会社 2023-01-03 CN disclosed
CN-113631659-A Curable silicone composition, cured product thereof, and method for producing same 陶氏东丽株式会社 2021-11-09 CN disclosed
CN-113631660-A Curable silicone composition, cured product thereof, and method for producing same 陶氏东丽株式会社 2021-11-09 CN disclosed
CN-113614174-A Curable silicone composition, cured product thereof, and method for producing same 陶氏东丽株式会社 2021-11-05 CN disclosed
CN-113396188-A Curable silicone composition for transfer molding, cured product thereof, and method for producing same 陶氏东丽株式会社 2021-09-14 CN disclosed
CN-113396042-A Method for producing curable silicone sheet having hot-melt property 陶氏东丽株式会社 2021-09-14 CN disclosed
CN-113330071-A Curable silicone composition, cured product thereof, and method for producing same 陶氏东丽株式会社 2021-08-31 CN disclosed