Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.35 |
| ▸ | KCNH2 | Q12809 | 1/20 | 0.32 |
| ▸ | NFE2L2 | Q16236 | 1/20 | 0.32 |
| ▸ | TSHR | P16473 | 1/20 | 0.30 |
| ▸ | HTT | P42858 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL313949 | 0.81 | ALDH1A1 (0.38) | ALDH1A1KCNH2NFE2L2TSHRHTT | |
| SCHEMBL8748210 | 0.81 | ALDH1A1 (0.40) | ALDH1A1KCNH2NFE2L2TSHRHTT | |
| SCHEMBL16045449 | 0.80 | HTR6 (0.36) | ALDH1A1TSHR | |
| SCHEMBL29415223 | 0.80 | HTR6 (0.36) | ALDH1A1TSHR | |
| SCHEMBL5057784 | 0.78 | ALDH1A1 (0.38) | ALDH1A1KCNH2NFE2L2TSHRHTT | |
| SCHEMBL4122680 | 0.77 | ALDH1A1 (0.34) | ALDH1A1KCNH2NFE2L2 | |
| SCHEMBL313316 | 0.77 | ALDH1A1 (0.38) | ALDH1A1KCNH2NFE2L2 | |
| SCHEMBL7172894 | 0.76 | ALDH1A1 (0.33) | ALDH1A1KCNH2NFE2L2TSHRHTT | |
| SCHEMBL9567510 | 0.75 | ALDH1A1 (0.41) | ALDH1A1KCNH2NFE2L2TSHRHTT | |
| SCHEMBL3002542 | 0.75 | ALDH1A1 (0.36) | ALDH1A1KCNH2NFE2L2HTT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20100215979-A1 | Method of forming metal film and metal wiring pattern, undercoat composition for forming metal film and metal wiring pattern, and metal film | Nawafune, Hidemi (JP) | 2010-08-26 | — | — | US | disclosed |
| CN-101194042-A | Method for forming metal film and metal wiring pattern, foundation composition for formation of metal film and metal wiring pattern, and metal film | OMRON TATEISI ELECTRONICS CO (JP) | 2008-06-04 | — | — | CN | disclosed |