Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 1/20 | 0.46 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1991524 | 0.87 | TSHR (0.39) | TSHR | |
| SCHEMBL10602811 | 0.86 | TSHR (0.46) | TSHR | |
| SCHEMBL235281 | 0.83 | TSHR (0.44) | TSHR | |
| SCHEMBL703383 | 0.79 | — | — | |
| SCHEMBL706691 | 0.79 | — | — | |
| SCHEMBL713340 | 0.77 | ADRB2 (0.33) | TSHR | |
| SCHEMBL6708436 | 0.77 | TSHR (0.30) | TSHR | |
| SCHEMBL1123036 | 0.77 | TSHR (0.30) | TSHR | |
| SCHEMBL6708448 | 0.77 | TSHR (0.30) | TSHR | |
| SCHEMBL6706823 | 0.77 | TSHR (0.30) | TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 89 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12109812-B2 | Ink jet printing method and ink jet printing apparatus | SEIKO EPSON CORPORATION (JP) | 2024-10-08 | — | — | US | disclosed |
| CN-114055975-A | Ink jet recording method and ink jet recording apparatus | 精工爱普生株式会社 | 2022-02-18 | — | — | CN | disclosed |
| US-20220032618-A1 | Ink Jet Printing Method And Ink Jet Printing Apparatus | SEIKO EPSON CORPORATION (JP) | 2022-02-03 | — | — | US | disclosed |
| US-10759119-B2 | Three dimensional mold object manufacturing apparatus, method for manufacturing three dimensional mold object, and three dimensional mold object | SEIKO EPSON CORPORATION (JP) | 2020-09-01 | — | — | US | disclosed |
| US-10279603-B2 | Production method of recording material, and recording material | SEIKO EPSON CORPORATION (JP) | 2019-05-07 | — | — | US | disclosed |
| US-10259208-B2 | Three-dimensional shaped object manufacturing device, method for manufacturing three-dimensional shaped object, and three-dimensional shaped object | SEIKO EPSON CORPORATION (JP) | 2019-04-16 | — | — | US | disclosed |
| US-20190054704-A1 | THREE DIMENSIONAL MOLD OBJECT MANUFACTURING APPARATUS, METHOD FOR MANUFACTURING THREE DIMENSIONAL MOLD OBJECT, AND THREE DIMENSIONAL MOLD OBJECT | SEIKO EPSON CORPORATION (JP) | 2019-02-21 | — | — | US | disclosed |
| US-10137637-B2 | Three dimensional mold object manufacturing apparatus, method for manufacturing three dimensional mold object, and three dimensional mold object | SEIKO EPSON CORPORATION (JP) | 2018-11-27 | — | — | US | disclosed |
| US-10053590-B2 | Composition for inkjet and recording material | SEIKO EPSON CORPORATION (JP) | 2018-08-21 | — | — | US | disclosed |
| US-9950507-B2 | Three-dimensional structure manufacturing apparatus, manufacturing method of three-dimensional structure, and three-dimensional structure | SEIKO EPSON CORPORATION (JP) | 2018-04-24 | — | — | US | disclosed |
| US-8322033-B2 | Method for forming a conductive post for a multilayered wiring substrate | SEIKO EPSON CORPORATION (JP) | 2012-12-04 | — | — | US | disclosed |
| US-7776397-B2 | Process for producing chemical adsorption film and chemical adsorption film | SEIKO EPSON CORPORATION (JP) | 2010-08-17 | — | — | US | disclosed |
| US-20090077798-A1 | METHOD FOR FORMING CONDUCTIVE POST, METHOD FOR MANUFACTURING MULTILAYERED WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS | SEIKO EPSON CORPORATION (JP) | 2009-03-26 | — | — | US | disclosed |
| US-20090071706-A1 | METHOD FOR PRODUCING MULTILAYERED WIRING SUBSTRATE, MULTILAYERED WIRING SUBSTRATE, AND ELECTRONIC APPARATUS | SEIKO EPSON CORPORATION (JP) | 2009-03-19 | — | — | US | disclosed |
| US-7500895-B2 | Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device | SEIKO EPSON CORPORATION (JP) | 2009-03-10 | — | — | US | disclosed |
| US-20080317943-A1 | METHOD FOR FORMING PATTERN, METHOD FOR MANUFACTURING ELECTRO-OPTICAL DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | SEIKO EPSON CORPORATION (JP) | 2008-12-25 | — | — | US | disclosed |
| US-20080311285-A1 | CONTACT HOLE FORMING METHOD, CONDUCTING POST FORMING METHOD, WIRING PATTERN FORMING METHOD, MULTILAYERED WIRING SUBSTRATE PRODUCING METHOD, ELECTRO-OPTICAL DEVICE PRODUCING METHOD, AND ELECTRONIC APPARATUS PRODUCING METHOD | SEIKO EPSON CORPORATION (JP) | 2008-12-18 | — | — | US | disclosed |
| US-20060127563-A1 | Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device | SEIKO EPSON CORPORATION (JP) | 2006-06-15 | — | — | US | disclosed |
| US-20060019034-A1 | Process for producing chemical adsorption film and chemical adsorption film | SEIKO EPSON CORPORATION (JP) | 2006-01-26 | — | — | US | disclosed |
| US-20050287392-A1 | Organic electroluminescent device, method for producing the same, and electronic apparatus | SEIKO EPSON CORPORATION (JP) | 2005-12-29 | — | — | US | disclosed |