SCHEMBL28667481

SCHEMBL28667481

CC(C)(C)CC(=O)C(=O)OO

nearest known ligand 0.32

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
HMGCR P04035 1/20 0.31
CHRM1 P11229 1/20 0.31
TBXA2R P21731 1/20 0.31
ADRA1A P35348 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4574752 0.80 ALDH1A1 (0.42)
SCHEMBL8184932 0.79 TET2 (0.39) HMGCRCHRM1TBXA2RADRA1A
SCHEMBL11389705 0.77
SCHEMBL14914212 0.76 HMGCR (0.40) HMGCRCHRM1TBXA2RADRA1A
SCHEMBL2100269 0.75 TET2 (0.35)
SCHEMBL8433400 0.73
SCHEMBL122716 0.72
SCHEMBL3697055 0.69 HMGCR (0.41) HMGCRCHRM1TBXA2RADRA1A
SCHEMBL7146267 0.69
SCHEMBL6857048 0.69 CES1 (0.38) HMGCRCHRM1TBXA2RADRA1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113632219-A Thermally conductive composition and semiconductor device 住友电木株式会社 2021-11-09 CN disclosed
CN-113631675-A Semiconductor package, method for manufacturing semiconductor package, and thermally conductive composition used therefor 住友电木株式会社 2021-11-09 CN disclosed