SCHEMBL287060

SCHEMBL287060

CCN=C=NC(C)CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28210729 0.85 TRPA1 (0.36)
Hydrochloric Acid SCHEMBL28210727 0.83 TRPA1 (0.34)
SCHEMBL1883811 0.83 TRPA1 (0.60)
SCHEMBL7484113 0.78
SCHEMBL4429218 0.77 ALDH1A1 (0.35)
SCHEMBL939422 0.77 CYP1A2 (0.41)
SCHEMBL23598722 0.76 TRPA1 (0.52)
Hydrochloric Acid SCHEMBL4275672 0.76
SCHEMBL9542006 0.76
SCHEMBL20203690 0.76 TRPA1 (0.52)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260078256-A1 THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT POLYPLASTICS-EVONIK CORPORATION (JP) 2026-03-19 US disclosed
US-12577444-B2 Polymer compound, method for producing polymer compound, adhesive composition, cured product, method for producing adhesive composition, and method for adjusting adhesion force NATIONAL INSTITUTE FOR MATERIALS SCIENCE (JP) 2026-03-17 US disclosed
EP-4624533-A1 THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT Polyplastics-Evonik Corporation (JP) 2025-10-01 EP disclosed
CN-119137219-A Thermosetting resin composition and cured product 宝理塑料赢创有限公司 2024-12-13 CN disclosed
CN-118922404-A Compound, polymerizable composition, cured product, color filter, partition wall, and image display device 三菱化学株式会社 2024-11-08 CN disclosed
EP-4101870-B1 POLYMER COMPOUND, METHOD FOR PRODUCING POLYMER COMPOUND, ADHESIVE COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING ADHESIVE COMPOSITION, AND METHOD FOR ADJUSTING ADHESIVE STRENGTH NAT INST MATERIALS SCIENCE (JP) 2024-10-02 EP disclosed
WO-2024111181-A1 THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT ポリプラ・エボニック株式会社 2024-05-30 WO disclosed
WO-2023190410-A1 COMPOUND, POLYMERIZABLE COMPOSITION, CURED PRODUCT, COLOR FILTER, PARTITION WALL AND IMAGE DISPLAY DEVICE 三菱ケミカル株式会社 2023-10-05 WO disclosed
US-20230101138-A1 POLYMER COMPOUND, METHOD FOR PRODUCING POLYMER COMPOUND, ADHESIVE COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING ADHESIVE COMPOSITION, AND METHOD FOR ADJUSTING ADHESION FORCE NATIONAL INSTITUTE FOR MATERIALS SCIENCE (JP) 2023-03-30 US disclosed
EP-4101870-A1 POLYMER COMPOUND, METHOD FOR PRODUCING POLYMER COMPOUND, ADHESIVE COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING ADHESIVE COMPOSITION, AND METHOD FOR ADJUSTING ADHESIVE STRENGTH National Institute for Materials Science (JP) 2022-12-14 EP disclosed
US-8669398-B2 Polymerisation initiator BASF SE (DE) 2014-03-11 US disclosed
US-8664288-B2 O-imino-iso-urea compounds and polymerizable compositions thereof BASF SE (DE) 2014-03-04 US disclosed
US-20120108696-A1 O-IMINO-ISO-UREA COMPOUNDS AND POLYMERIZABLE COMPOSITIONS THEREOF BASF SE (DE) 2012-05-03 US disclosed
CN-102421749-A O-iminoisourea compounds and polymerizable compositions thereof BASF SE 2012-04-18 CN disclosed
EP-2427428-A1 O-IMINO-ISO-UREA COMPOUNDS AND POLYMERIZABLE COMPOSITIONS THEREOF BASF SE (DE) 2012-03-14 EP disclosed
US-20110288251-A1 POLYMERISATION INITIATOR BASF SE (DE) 2011-11-24 US disclosed
EP-2385937-A1 POLYMERISATION INITIATOR BASF SE (DE) 2011-11-16 EP disclosed
US-8040847-B2 Channel estimation feedback in an orthogonal frequency division multiplexing system or the like INTEL CORPORATION (US) 2011-10-18 US disclosed
WO-2010128062-A1 O-IMINO-ISO-UREA COMPOUNDS AND POLYMERIZABLE COMPOSITIONS THEREOF BASF SE (DE) 2010-11-11 WO disclosed
WO-2010079102-A1 POLYMERISATION INITIATOR BASF SE (DE) 2010-07-15 WO disclosed