SCHEMBL28736616

SCHEMBL28736616

COC(=O)C(=O)O.O=C(O)C1(O)CCNCC1

nearest known ligand 0.39

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.35
KMT2A Q03164 1/20 0.35
OPRM1 P35372 2/20 0.32
SIGMAR1 Q99720 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1282200 0.82 KDM4E (0.37) KDM4EKMT2AOPRM1
Hydrochloric Acid SCHEMBL5750787 0.80 KDM4E (0.35) KDM4EKMT2AOPRM1
Piperazine SCHEMBL28121557 0.80 ALDH1A1 (0.36) KDM4EKMT2A
SCHEMBL854175 0.74 KDM4E (0.41) KDM4EKMT2AOPRM1SIGMAR1
Piperidine SCHEMBL3849398 0.74 ALDH1A1 (0.41)
SCHEMBL7042591 0.72
SCHEMBL126786 0.69
Toluene SCHEMBL27914297 0.69 OPRM1 (0.46) KMT2AOPRM1SIGMAR1
SCHEMBL1855601 0.69
SCHEMBL2077252 0.68 NPSR1 (0.37) KDM4EKMT2AOPRM1SIGMAR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114349922-A Flexible dual-curing resin composition and preparation method of forming body thereof 浙江华峰新材料有限公司 2022-04-15 CN claimed
CN-114349922-B Flexible dual-cured resin composition and preparation method of molded body thereof 浙江华峰新材料有限公司 2024-01-23 CN disclosed
CN-114349922-A Flexible dual-curing resin composition and preparation method of forming body thereof 浙江华峰新材料有限公司 2022-04-15 CN disclosed