Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Vinyl Chloride SCHEMBL8670745 | 0.85 | ALDH1A1 (0.38) | MGLLDHFR | |
| SCHEMBL380904 | 0.85 | TP53 (0.44) | MGLLDHFR | |
| SCHEMBL9248419 | 0.81 | MGLL (0.44) | MGLLDHFR | |
| SCHEMBL13006061 | 0.81 | HDAC4 (0.45) | MGLLDHFR | |
| Acrylic Acid Methyl Ester SCHEMBL1470696 | 0.80 | ALDH1A1 (0.37) | MGLL | |
| SCHEMBL3977301 | 0.80 | HDAC4 (0.44) | MGLLDHFR | |
| Styrene SCHEMBL670007 | 0.77 | MGLL (0.56) | MGLL | |
| Vinyl Chloride SCHEMBL9574774 | 0.76 | ALDH1A1 (0.41) | MGLLDHFR | |
| SCHEMBL7557454 | 0.75 | ALDH1A1 (0.52) | MGLLDHFR | |
| Styrene SCHEMBL27461465 | 0.75 | MGLL (0.51) | MGLL |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1736512-B1 | CONDUCTIVE RESIN COMPOSITION | ASAHI KASEL CHEMICALS CORP (JP) | 2011-12-14 | — | — | EP | disclosed |
| US-7696274-B2 | Conductive resin composition | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2010-04-13 | — | — | US | disclosed |
| US-20070205401-A1 | Conductive Resin Composition | ASAHI KASEL CHEMICALS CORPORATION (JP) | 2007-09-06 | — | — | US | disclosed |
| EP-1736512-A1 | CONDUCTIVE RESIN COMPOSITION | Asahi Kasei Chemicals Corporation (JP) | 2006-12-27 | — | — | EP | disclosed |
| EP-0717079-B1 | Injection molded article for photographic photosensitive material, molding method thereof and package using the same | FUJI PHOTO FILM CO LTD (JP) | 2002-07-24 | — | — | EP | disclosed |
| EP-0717079-A2 | Injection molded article for photographic photosensitive material, molding method thereof and package using the same | Fuji Photo Film Co., Ltd. (JP) | 1996-06-19 | — | — | EP | disclosed |