SCHEMBL28790102

SCHEMBL28790102

CCN(C(C)=O)[Si](CC)(CC)N(CC)C(C)=O

nearest known ligand 0.32

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
CHRM1 P11229 3/20 0.32
CHRM2 P08172 2/20 0.32
CHRM4 P08173 2/20 0.32
CHRM5 P08912 2/20 0.32
CHRM3 P20309 2/20 0.32
ALDH1A1 P00352 1/20 0.32
TDP1 Q9NUW8 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29009674 0.80 CHRM2 (0.30) CHRM1CHRM2CHRM4CHRM5CHRM3
SCHEMBL28790096 0.80 CA12 (0.34) ALDH1A1
SCHEMBL9850901 0.79 CHRM1 (0.32) CHRM1CHRM2CHRM4CHRM5CHRM3
SCHEMBL203529 0.76 CHRM1 (0.33) CHRM1CHRM2CHRM4CHRM5CHRM3
SCHEMBL9422287 0.76 CHRM1 (0.33) CHRM1CHRM2CHRM4CHRM5CHRM3
SCHEMBL11678374 0.76 CHRM1 (0.38) CHRM1CHRM2CHRM4CHRM5CHRM3
SCHEMBL204405 0.72 ALDH1A1 (0.31) ALDH1A1
SCHEMBL11329616 0.70 ALDH1A1 (0.33) CHRM1CHRM2CHRM4CHRM5CHRM3
SCHEMBL22769511 0.69 CHRM2 (0.33) CHRM1CHRM2CHRM4CHRM5CHRM3
SCHEMBL27981313 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116507668-B Additive stabilization 美国陶氏有机硅公司 2024-05-31 CN disclosed
CN-117377715-A Silicone composition and preparation thereof 美国陶氏有机硅公司 2024-01-09 CN disclosed
CN-114901725-B Polydiorganosiloxane preparation 美国陶氏有机硅公司 2023-09-08 CN disclosed
CN-116507668-A Additive stabilization 美国陶氏有机硅公司 2023-07-28 CN disclosed
CN-116209721-A Polydiorganosiloxane preparation 美国陶氏有机硅公司 2023-06-02 CN disclosed
CN-116171298-A Polydiorganosiloxane preparation 美国陶氏有机硅公司 2023-05-26 CN disclosed
CN-114901725-A Preparation of polydiorganosiloxane 美国陶氏有机硅公司 2022-08-12 CN disclosed
CN-114787263-A Sealant composition 美国陶氏有机硅公司 2022-07-22 CN disclosed