SCHEMBL28809232

SCHEMBL28809232

C=CC(=O)OOC(C)(CC(=O)O)C(=O)O

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 7/20 0.38
HIF1A Q16665 4/20 0.38
CYP2D6 P10635 1/20 0.38
CYP2C19 P33261 1/20 0.38
HMGCR P04035 1/20 0.34
CHRM1 P11229 1/20 0.34
TBXA2R P21731 1/20 0.34
ADRA1A P35348 1/20 0.34
ALDH1A1 P00352 5/20 0.32
TP53 P04637 3/20 0.32
CYP3A4 P08684 2/20 0.32
MAPK1 P28482 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
HPGD P15428 1/20 0.32
KDM4E B2RXH2 1/20 0.31
FFAR1 O14842 1/20 0.31
CPT2 P23786 1/20 0.31
TDP1 Q9NUW8 1/20 0.31
HSD17B10 Q99714 1/20 0.31
THRB P10828 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7558348 0.81 TSHR (0.40) TSHRHIF1ACYP2D6CYP2C19HMGCR
Ammonia Solution, Strong SCHEMBL28082914 0.80 TSHR (0.39) TSHRHIF1ACYP2D6CYP2C19HMGCR
SCHEMBL28060067 0.73 HPGD (0.32) TSHRHMGCRCHRM1TBXA2RADRA1A
SCHEMBL8881160 0.72 TSHR (0.38) TSHRHIF1AALDH1A1TP53CYP3A4
SCHEMBL8886527 0.71 TSHR (0.38) TSHRHIF1AALDH1A1TP53CYP3A4
SCHEMBL15820667 0.70 TSHR (0.31) TSHR
SCHEMBL28838440 0.70 CYP2D6 (0.36) TSHRHIF1ACYP2D6CYP2C19HMGCR
SCHEMBL28520902 0.70 ALDH1A1 (0.39) TSHRHIF1AALDH1A1TP53CYP3A4
SCHEMBL8892386 0.69 THRB (0.41) TSHRHIF1AALDH1A1TP53CYP3A4
SCHEMBL20079310 0.69 HMGCR (0.39) TSHRHIF1ACYP2D6CYP2C19HMGCR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-103562436-B Undercoat layer for plating process, laminate for wiring board and method for manufacturing the same, and multilayer wiring board and method for manufacturing the same HITACHI CHEMICAL CO.,LTD. (JP) 2015-10-14 CN disclosed
CN-103562436-A Undercoat layer for plating process, laminate for wiring board and method for manufacturing the same, and multilayer wiring board and method for manufacturing the same HITACHI CHEMICAL CO LTD 2014-02-05 CN disclosed