Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.42 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.38 |
| ▸ | CA1 | P00915 | 1/20 | 0.37 |
| ▸ | CA2 | P00918 | 1/20 | 0.37 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.36 |
| ▸ | TP53 | P04637 | 1/20 | 0.36 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.36 |
| ▸ | TSHR | P16473 | 2/20 | 0.35 |
| ▸ | LPAR1 | Q92633 | 1/20 | 0.34 |
| ▸ | LPAR3 | Q9UBY5 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL93242 | 0.84 | CA2 (0.54) | ALDH1A1SMN1; SMN2CA1CA2TDP1 | |
| SCHEMBL6912216 | 0.82 | ALDH1A1 (0.47) | ALDH1A1SMN1; SMN2CA1CA2TDP1 | |
| SCHEMBL21318433 | 0.82 | ALDH1A1 (0.47) | ALDH1A1SMN1; SMN2CA1CA2TDP1 | |
| SCHEMBL28550282 | 0.81 | ALDH1A1 (0.49) | ALDH1A1SMN1; SMN2CA1CA2TDP1 | |
| SCHEMBL28548252 | 0.81 | ALDH1A1 (0.49) | ALDH1A1SMN1; SMN2CA1CA2TDP1 | |
| SCHEMBL9770339 | 0.81 | ALDH1A1 (0.49) | ALDH1A1SMN1; SMN2CA1CA2TDP1 | |
| SCHEMBL1715067 | 0.80 | ALDH1A1 (0.43) | ALDH1A1SMN1; SMN2CA1CA2TDP1 | |
| SCHEMBL600501 | 0.80 | ALDH1A1 (0.44) | ALDH1A1SMN1; SMN2CA1CA2TDP1 | |
| Water SCHEMBL28201965 | 0.79 | ALDH1A1 (0.42) | ALDH1A1SMN1; SMN2CA1CA2TDP1 | |
| SCHEMBL4357657 | 0.79 | CA2 (0.46) | ALDH1A1SMN1; SMN2CA1CA2TDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-103717634-B | For semiconductor packages composition epoxy resin, use its semiconductor device and the method being used for producing the semiconductor devices | 纳美仕有限公司 | 2016-11-23 | — | — | CN | disclosed |
| CN-106062027-A | Method for curing resin composition | 欧姆龙株式会社 | 2016-10-26 | — | — | CN | disclosed |
| CN-106062028-A | Resin composition and cured product thereof | 欧姆龙株式会社 | 2016-10-26 | — | — | CN | disclosed |