SCHEMBL28865754

SCHEMBL28865754

CCCO[Si](CCCN=Cc1ccccc1)(OCCC)OCCC

nearest known ligand 0.39

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
CA2 P00918 2/20 0.39
ALDH1A1 P00352 2/20 0.38
KMT2A Q03164 2/20 0.38
FAAH O00519 10/20 0.36
TAAR1 Q96RJ0 1/20 0.35
CA12 O43570 1/20 0.34
CA1 P00915 1/20 0.34
CA9 Q16790 1/20 0.34
KDM4E B2RXH2 1/20 0.33
GAA P10253 1/20 0.33
MAPT P10636 1/20 0.33
PPARG P37231 2/20 0.33
PPARA Q07869 2/20 0.33
MEN1 O00255 1/20 0.33
LMNA P02545 1/20 0.32
L3MBTL1 Q9Y468 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12250807 0.89 CA2 (0.41) CA2ALDH1A1KMT2ATAAR1CA12
SCHEMBL1259700 0.89 CA2 (0.41) CA2ALDH1A1KMT2ATAAR1CA12
SCHEMBL1259701 0.89 CA2 (0.41) CA2ALDH1A1KMT2ATAAR1CA12
Dimethylamine SCHEMBL329226 0.85 CA2 (0.39) CA2ALDH1A1KMT2AFAAHTAAR1
SCHEMBL12250808 0.83 KDM4E (0.36) CA2ALDH1A1KMT2ATAAR1CA12
Diethylamine SCHEMBL12983554 0.83 CA2 (0.37) CA2ALDH1A1KMT2AFAAHTAAR1
SCHEMBL23526498 0.81 CA2 (0.42) CA2ALDH1A1KMT2ATAAR1CA12
SCHEMBL2861245 0.81 CA2 (0.42) CA2ALDH1A1KMT2ATAAR1CA12
SCHEMBL2861242 0.81 CA2 (0.42) CA2ALDH1A1KMT2ATAAR1CA12
SCHEMBL22317361 0.81 ALDH1A1 (0.44) CA2ALDH1A1KMT2ATAAR1CA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115210322-B Resin composition, wiring board, and method for producing conductive pattern 东丽株式会社 2023-10-20 CN disclosed
CN-115210322-A Resin composition, wiring board, and method for producing conductive pattern 东丽株式会社 2022-10-18 CN disclosed