SCHEMBL28879040

SCHEMBL28879040

Cc1nccn1C=Cc1ccccc1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GRM4 Q14833 2/20 0.41
MAP4K4 O95819 1/20 0.41
PRKACA P17612 1/20 0.41
CDK8 P49336 1/20 0.41
MAPK14 Q16539 1/20 0.41
LRRK2 Q5S007 1/20 0.41
CLK4 Q9HAZ1 1/20 0.41
MAOB P27338 1/20 0.40
ALDH1A1 P00352 7/20 0.37
KMT2A Q03164 5/20 0.37
MAPT P10636 3/20 0.37
MAPK1 P28482 3/20 0.37
TDP1 Q9NUW8 2/20 0.37
L3MBTL1 Q9Y468 2/20 0.37
POLB P06746 1/20 0.37
LMNA P02545 1/20 0.37
HTT P42858 1/20 0.37
KDM4E B2RXH2 2/20 0.37
HPGD P15428 2/20 0.37
CCNE1 P24864 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5345997 0.72
SCHEMBL5345989 0.72
SCHEMBL7158047 0.70 TBXAS1 (0.48) MAP4K4PRKACACDK8MAPK14LRRK2
SCHEMBL8927292 0.70 TBXAS1 (0.48) MAP4K4PRKACACDK8MAPK14LRRK2
SCHEMBL9764337 0.70 SMN1; SMN2 (0.47) GRM4MAP4K4PRKACACDK8MAPK14
SCHEMBL29182099 0.69 ALDH1A1 (0.41) ALDH1A1KMT2APOLBCYP3A4
Hydrochloric Acid SCHEMBL27553888 0.69 TBXAS1 (0.47) MAP4K4PRKACACDK8MAPK14LRRK2
SCHEMBL2517168 0.68 MAOB (0.48) MAOBALDH1A1KMT2AMAPTMAPK1
SCHEMBL2517164 0.68 MAOB (0.48) MAOBALDH1A1KMT2AMAPTMAPK1
SCHEMBL11664007 0.68 MAOB (0.48) MAOBALDH1A1KMT2AMAPTMAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115283881-A Soldering flux, high-viscosity paste thereof, preparation method of high-viscosity paste, solder paste and application of solder paste 广东省科学院中乌焊接研究所 2022-11-04 CN disclosed