SCHEMBL28887809

SCHEMBL28887809

CO[SiH](CC(N)CCCCO)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1446668 0.82 GSR (0.33)
SCHEMBL28387883 0.81 OPRM1 (0.30)
SCHEMBL28268092 0.80 PLA2G1B (0.46)
SCHEMBL7717448 0.79
SCHEMBL28266507 0.79 PLA2G1B (0.35)
Dimethylamine SCHEMBL15939560 0.77 S1PR2 (0.40)
SCHEMBL5693738 0.74 CA12 (0.37)
SCHEMBL28975976 0.74
SCHEMBL3161023 0.74 ALDH1A1 (0.31)
SCHEMBL18349456 0.72 LTA4H (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115702270-A Fiber sizing agent, fiber material, molding material, and molded article DIC株式会社 2023-02-14 CN disclosed
CN-110662865-B Fiber bundling agent, fiber material, molding material and molded article DIC株式会社 2022-06-24 CN disclosed
CN-114539501-A Fiber bundling agent, fiber bundle, molding material and molded article DIC株式会社 2022-05-27 CN disclosed
CN-113056584-A Fiber bundling agent, fiber material, molding material and molded article DIC株式会社 2021-06-29 CN disclosed
CN-110662865-A Fiber bundling agent, fiber material, molding material and molded article DIC株式会社 2020-01-07 CN disclosed