SCHEMBL28894550

SCHEMBL28894550

O=C(O)C1CCCCC1C(=O)Oc1cccc2cc3ccccc3cc12

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ L3MBTL1 Q9Y468 3/20 0.49
▸ MEN1 O00255 2/20 0.49
▸ KMT2A Q03164 2/20 0.49
▸ RAB9A P51151 2/20 0.49
▸ ALDH1A1 P00352 1/20 0.47
▸ KDM4E B2RXH2 1/20 0.46
▸ FABP3 P05413 8/20 0.43
▸ FABP7 O15540 7/20 0.43
▸ FABP5 Q01469 5/20 0.43
▸ ESR1 P03372 1/20 0.42
▸ ESR2 Q92731 1/20 0.42
▸ FNTA P49354 1/20 0.40
▸ FNTB P49356 1/20 0.40
▸ GRK2 P25098 1/20 0.38
▸ CASP6 P55212 1/20 0.38
▸ CASP8 Q14790 1/20 0.38
▸ CTDSP1 Q9GZU7 1/20 0.38
▸ TDP1 Q9NUW8 1/20 0.38
▸ APEX1 P27695 1/20 0.38
▸ NPSR1 Q6W5P4 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29963396 0.82 KDM4E (0.49) L3MBTL1MEN1KMT2ARAB9AALDH1A1
SCHEMBL28894490 0.82 KDM4E (0.49) L3MBTL1MEN1KMT2ARAB9AALDH1A1
SCHEMBL30384576 0.82 KMT2A (0.64) L3MBTL1MEN1KMT2ARAB9AALDH1A1
SCHEMBL28894336 0.77 KDM4E (0.44) L3MBTL1MEN1KMT2ARAB9AALDH1A1
SCHEMBL7857986 0.77 FNTA (0.54) L3MBTL1MEN1KMT2ARAB9AALDH1A1
SCHEMBL28894533 0.76 KDM4E (0.44) L3MBTL1MEN1KMT2ARAB9AALDH1A1
SCHEMBL8075767 0.75 ALDH1A1 (0.49) L3MBTL1MEN1KMT2ARAB9AALDH1A1
SCHEMBL22263926 0.74 KMT2A (0.44) L3MBTL1MEN1KMT2ARAB9AALDH1A1
SCHEMBL29963927 0.74 KDM4E (0.48) L3MBTL1MEN1KMT2ARAB9AALDH1A1
SCHEMBL28894842 0.74 MEN1 (0.56) L3MBTL1MEN1KMT2ARAB9AALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115380075-B Epoxy resin composition for sealing semiconductor 纳美仕有限公司 2024-06-18 — — CN disclosed
CN-115380075-A Epoxy resin composition for semiconductor encapsulation 纳美仕有限公司 2022-11-22 — — CN disclosed
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