SCHEMBL28967686

SCHEMBL28967686

CC(=Cc1ccccc1O)C(=O)Oc1ccc(C=Cc2ccccc2)cc1O

nearest known ligand 0.53

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
TUBB1 Q9H4B7 1/20 0.53
TRPA1 O75762 1/20 0.44
PTPN1 P18031 4/20 0.42
HNF4A P41235 1/20 0.42
MAPT P10636 3/20 0.41
BACE1 P56817 2/20 0.41
MEN1 O00255 1/20 0.41
ALDH1A1 P00352 1/20 0.41
THRB P10828 1/20 0.41
KMT2A Q03164 1/20 0.41
TDP1 Q9NUW8 1/20 0.41
TTR P02766 1/20 0.41
CYP1A1 P04798 1/20 0.40
CYP1A2 P05177 1/20 0.40
CYP1B1 Q16678 1/20 0.40
APP P05067 2/20 0.40
LMNA P02545 1/20 0.38
LCK P06239 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28759863 0.80 TUBB1 (0.67) TUBB1PTPN1HNF4AMAPTBACE1
SCHEMBL28967687 0.74 TRPA1 (0.57) TUBB1TRPA1MAPTTDP1APP
SCHEMBL18130102 0.71 IAPP (0.57) PTPN1MAPTBACE1MEN1ALDH1A1
SCHEMBL18130100 0.71 IAPP (0.57) PTPN1MAPTBACE1MEN1ALDH1A1
SCHEMBL8073706 0.71 PELI1 (0.43) TUBB1TRPA1PTPN1MAPTBACE1
SCHEMBL5496427 0.71 TUBB1 (1.00) TUBB1MAPTBACE1ALDH1A1CYP1A1
SCHEMBL30873010 0.71 TUBB1 (1.00) TUBB1MAPTBACE1ALDH1A1CYP1A1
SCHEMBL8072257 0.71 MAPT (0.49) MAPTTDP1LMNA
SCHEMBL5496418 0.71 TUBB1 (1.00) TUBB1MAPTBACE1ALDH1A1CYP1A1
SCHEMBL8072253 0.71 MAPT (0.49) MAPTTDP1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115769145-A Conductive paste, printed wiring board, method for manufacturing printed wiring board, and method for manufacturing printed wiring board 东丽株式会社 2023-03-07 CN disclosed