SCHEMBL2898647

SCHEMBL2898647

N#CCCN1CCN=C1c1ccccc1

nearest known ligand 0.45

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
▸ TOP2A P11388 3/20 0.44
▸ TOP2B Q02880 3/20 0.44
▸ POLB P06746 1/20 0.41
▸ ALDH1A1 P00352 2/20 0.40
▸ LMNA P02545 1/20 0.40
▸ KDM4E B2RXH2 1/20 0.39
▸ MAPT P10636 1/20 0.39
▸ CYP1A2 P05177 1/20 0.39
▸ CYP2D6 P10635 1/20 0.39
▸ MEN1 O00255 1/20 0.38
▸ KMT2A Q03164 1/20 0.38
▸ RAB9A P51151 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10365364 0.80 TOP2A (0.47) TOP2ATOP2BALDH1A1CYP1A2CYP2D6
SCHEMBL28088766 0.80 TOP2A (0.47) TOP2ATOP2BALDH1A1LMNACYP1A2
SCHEMBL9207860 0.80 TOP2A (0.66) TOP2ATOP2BPOLBALDH1A1CYP1A2
SCHEMBL11135067 0.77 TOP2A (0.48) TOP2ATOP2BCYP1A2CYP2D6MEN1
SCHEMBL7561044 0.76 TOP2A (0.47) TOP2ATOP2BMEN1KMT2A
SCHEMBL7118380 0.76 TOP2A (0.66) TOP2ATOP2BALDH1A1MEN1KMT2A
SCHEMBL11135109 0.75 MAPT (0.60) TOP2ATOP2BMAPTMEN1KMT2A
SCHEMBL11134339 0.75 ACHE (0.46) TOP2ATOP2BALDH1A1KDM4E
SCHEMBL11137789 0.75 MEN1 (0.47) TOP2ATOP2BALDH1A1CYP1A2CYP2D6
SCHEMBL11134767 0.75 MEN1 (0.47) TOP2ATOP2BALDH1A1CYP1A2CYP2D6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118256135-A Coating composition and method for forming coating film 日涂汽车涂料有限公司 2024-06-28 — — CN disclosed
US-12011787-B2 Flux, solder paste, and electronic circuit board HARIMA CHEMICALS, INCORPORATED (JP) 2024-06-18 — — US disclosed
CN-113677814-B Flux, solder paste, and electronic circuit board 哈利玛化成株式会社 2022-09-13 — — CN disclosed
US-20220193834-A1 FLUX, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD HARIMA CHEMICALS, INCORPORATED (JP) 2022-06-23 — — US disclosed
EP-3954796-A1 FLUX, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD Harima Chemicals, Incorporated (JP) 2022-02-16 — — EP disclosed
CN-113677814-A Flux, solder paste, and electronic circuit board 哈利玛化成株式会社 2021-11-19 — — CN disclosed
US-20210047539-A1 COATING COMPOSITION AND METHOD FOR FORMING COATING FILM NIPPON PAINT AUTOMOTIVE COATINGS CO., LTD. (JP) 2021-02-18 — — US disclosed
CN-111655808-A Coating composition and method for forming coating film 日涂汽车涂料有限公司 2020-09-11 — — CN disclosed
WO-2019150776-A1 COATING COMPOSITION AND METHOD FOR FORMING COATING FILM 日本ペイント・オートモーティブコーティングス株式会社 2019-08-08 — — WO disclosed
US-9169403-B2 Powder coating composition for PC strand coating, coating method, and coating film NIPPON PAINT CO., LTD. (JP) 2015-10-27 — — US disclosed
EP-2186865-B1 POWDER COATING COMPOSITION FOR PC STRAND COATING, COATING METHOD, AND COATING FILM SUMITOMO SEI STEEL WIRE CORP (JP) 2013-10-02 — — EP disclosed
US-20100233478-A1 POWDER COATING COMPOSITION FOR PC STRAND COATING, COATING METHOD, AND COATING FILM SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) 2010-09-16 — — US disclosed
EP-2186865-A1 POWDER COATING COMPOSITION FOR PC STRAND COATING, COATING METHOD, AND COATING FILM Sumitomo (Sei) Steel Wire Corp. (JP) 2010-05-19 — — EP disclosed
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