SCHEMBL2898802

SCHEMBL2898802

Oc1ccc(Oc2cccc(Oc3ccc(O)cc3)n2)cc1

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LTA4H P09960 3/20 0.60
NR1H2 P55055 1/20 0.60
BAX Q07812 1/20 0.60
F2 P00734 4/20 0.58
F10 P00742 4/20 0.58
PRSS1 P07477 1/20 0.58
PRSS2 P07478 1/20 0.58
PRSS3 P35030 1/20 0.58
ST14 Q9Y5Y6 1/20 0.58
MEN1 O00255 1/20 0.56
KMT2A Q03164 1/20 0.56
ESR1 P03372 1/20 0.56
ESR2 Q92731 1/20 0.56
ALDH1A1 P00352 2/20 0.45
HPGD P15428 2/20 0.45
HSD17B10 Q99714 2/20 0.45
KDM4E B2RXH2 1/20 0.45
HSD17B14 Q9BPX1 2/20 0.43
GAA P10253 1/20 0.43
NR2F2 P24468 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2905330 0.94 LTA4H (0.54) LTA4HNR1H2BAXF2F10
SCHEMBL2903641 0.94 LTA4H (0.54) LTA4HNR1H2BAXF2F10
SCHEMBL2906403 0.89 F2 (0.49) LTA4HNR1H2BAXF2F10
SCHEMBL9271136 0.86 L3MBTL1 (0.50) LTA4HNR1H2BAXF2F10
SCHEMBL28519338 0.86 MEN1 (0.46) LTA4HNR1H2BAXF2F10
SCHEMBL2904926 0.84 ESR1 (0.52) LTA4HNR1H2BAXF2F10
SCHEMBL2903652 0.84 F2 (0.49) LTA4HNR1H2BAXF2F10
SCHEMBL2905358 0.82 L3MBTL1 (0.47) LTA4HNR1H2BAXF2F10
SCHEMBL11537806 0.82 GAA (0.55) LTA4HNR1H2BAXF2F10
SCHEMBL108119 0.81 F10 (0.50) LTA4HNR1H2BAXF2F10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1636209-B1 EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT SUMITOMO CHEMICAL CO (JP) 2010-08-11 EP disclosed
US-7279574-B2 Epoxy compound and cured epoxy resin product SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2007-10-09 US disclosed
US-20060159929-A1 Epoxy compound and cured epoxy resin product HITACHI, LTD. (JP) 2006-07-20 US disclosed