SCHEMBL2905358

SCHEMBL2905358

Oc1ccc(-c2ccc(Oc3cccc(Cl)n3)cc2)cc1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
L3MBTL1 Q9Y468 1/20 0.47
KDM1A O60341 1/20 0.43
F2 P00734 2/20 0.42
F10 P00742 2/20 0.42
PRSS1 P07477 1/20 0.42
PRSS2 P07478 1/20 0.42
PRSS3 P35030 1/20 0.42
ST14 Q9Y5Y6 1/20 0.42
ESR2 Q92731 3/20 0.42
ESR1 P03372 3/20 0.42
MEN1 O00255 2/20 0.42
KMT2A Q03164 2/20 0.42
LTA4H P09960 1/20 0.41
NR1H2 P55055 1/20 0.41
BAX Q07812 1/20 0.41
ALDH1A1 P00352 1/20 0.40
POLB P06746 1/20 0.40
MAPT P10636 1/20 0.40
HPGD P15428 1/20 0.40
HSD17B10 Q99714 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9271136 0.95 L3MBTL1 (0.50) L3MBTL1KDM1AF2F10PRSS1
SCHEMBL9496948 0.91 L3MBTL1 (0.49) L3MBTL1F2F10PRSS1PRSS2
SCHEMBL2905330 0.88 LTA4H (0.54) F2F10PRSS1PRSS2PRSS3
SCHEMBL2903641 0.88 LTA4H (0.54) F2F10PRSS1PRSS2PRSS3
SCHEMBL9491757 0.86 L3MBTL1 (0.53) L3MBTL1F2F10PRSS1PRSS2
SCHEMBL9492874 0.84 L3MBTL1 (0.51) L3MBTL1F2F10PRSS1PRSS2
SCHEMBL2898802 0.82 LTA4H (0.60) F2F10PRSS1PRSS2PRSS3
SCHEMBL958339 0.80 MEN1 (0.51) L3MBTL1F2F10PRSS1PRSS2
SCHEMBL2904926 0.79 ESR1 (0.52) F2F10PRSS1PRSS2PRSS3
SCHEMBL2144034 0.78 L3MBTL1 (0.54) L3MBTL1F2F10PRSS1PRSS2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1636209-B1 EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT SUMITOMO CHEMICAL CO (JP) 2010-08-11 EP disclosed
US-7279574-B2 Epoxy compound and cured epoxy resin product SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2007-10-09 US disclosed
US-20060159929-A1 Epoxy compound and cured epoxy resin product HITACHI, LTD. (JP) 2006-07-20 US disclosed
EP-1636209-A1 EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT Sumitomo Chemical Company, Limited (JP) 2006-03-22 EP disclosed
WO-2004113327-A1 EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2004-12-29 WO disclosed