SCHEMBL29006465

SCHEMBL29006465

Oc1ccc(-c2c(O)c(O)c(F)c(F)c2O)cc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ SENP1 Q9P0U3 3/20 0.54
▸ ESR1 P03372 3/20 0.46
▸ ESR2 Q92731 3/20 0.46
▸ PREP P48147 2/20 0.42
▸ PDE4A P27815 1/20 0.41
▸ PDE4B Q07343 1/20 0.41
▸ PDE4C Q08493 1/20 0.41
▸ PDE4D Q08499 1/20 0.41
▸ MGAM O43451 1/20 0.40
▸ GAA P10253 1/20 0.40
▸ SI P14410 1/20 0.40
▸ MGAM2 Q2M2H8 1/20 0.40
▸ KIF11 P52732 2/20 0.39
▸ MMP3 P08254 1/20 0.39
▸ BCL2L1 Q07817 1/20 0.39
▸ CELA1 Q9UNI1 1/20 0.38
▸ MEN1 O00255 2/20 0.38
▸ NPC1 O15118 2/20 0.38
▸ MAPT P10636 2/20 0.38
▸ NFKB1 P19838 2/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29006507 0.88 SENP1 (0.52) SENP1ESR1ESR2PREPPDE4A
SCHEMBL25423525 0.86 SENP1 (0.48) SENP1ESR1ESR2PREPPDE4A
SCHEMBL25419910 0.86 SENP1 (0.48) SENP1ESR1ESR2PREPPDE4A
SCHEMBL25421021 0.84 SENP1 (0.52) SENP1ESR1ESR2PREPPDE4A
SCHEMBL4451076 0.83 SENP1 (0.50) SENP1ESR1ESR2PREPPDE4A
SCHEMBL11694547 0.77 ESR1 (0.53) SENP1ESR1ESR2KIF11MMP3
SCHEMBL25422278 0.73 PDE4B (0.48) PDE4APDE4BPDE4CPDE4DMMP3
SCHEMBL1457230 0.73 ESR1 (0.71) SENP1ESR1ESR2MMP3BCL2L1
SCHEMBL13241353 0.71 ESR1 (0.46) SENP1ESR1ESR2KIF11MMP3
SCHEMBL29006472 0.71 SENP1 (0.48) SENP1ESR1ESR2PREPPDE4A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116157382-A Material for metal patterning, amine compound, electronic device, and method for forming metal pattern 东曹株式会社 2023-05-23 — — CN disclosed
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