SCHEMBL29044804

SCHEMBL29044804

C=C(Cl)[Si](OC)(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28119907 0.76
SCHEMBL315166 0.72
SCHEMBL27916957 0.71
Ethylene SCHEMBL28228274 0.69
SCHEMBL432980 0.69 ALDH1A1 (0.32)
SCHEMBL10719948 0.67 HSD17B10 (0.38)
SCHEMBL6849500 0.67
SCHEMBL8841144 0.67
SCHEMBL7799566 0.67
SCHEMBL25196844 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116656084-B Flame-retardant hydrocarbon resin for high-frequency copper-clad plate and preparation method thereof 江苏耀鸿电子有限公司 2023-12-29 CN claimed
CN-116656084-A Flame-retardant hydrocarbon resin for high-frequency copper-clad plate and preparation method thereof 江苏耀鸿电子有限公司 2023-08-29 CN claimed
CN-116533667-A High-transparency thermo-sensitive film based on microcapsule technology and processing technology thereof 江苏普仁新材料科技有限公司 2023-08-04 CN claimed
CN-116656084-B Flame-retardant hydrocarbon resin for high-frequency copper-clad plate and preparation method thereof 江苏耀鸿电子有限公司 2023-12-29 CN disclosed
CN-116656084-A Flame-retardant hydrocarbon resin for high-frequency copper-clad plate and preparation method thereof 江苏耀鸿电子有限公司 2023-08-29 CN disclosed
CN-116533667-A High-transparency thermo-sensitive film based on microcapsule technology and processing technology thereof 江苏普仁新材料科技有限公司 2023-08-04 CN disclosed