Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HNF4A | P41235 | 1/20 | 0.59 |
| ▸ | FABP3 | P05413 | 1/20 | 0.46 |
| ▸ | FABP4 | P15090 | 1/20 | 0.46 |
| ▸ | FABP5 | Q01469 | 1/20 | 0.46 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.45 |
| ▸ | MAPT | P10636 | 3/20 | 0.45 |
| ▸ | LMNA | P02545 | 2/20 | 0.45 |
| ▸ | MYC | P01106 | 1/20 | 0.45 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.45 |
| ▸ | BCAT2 | O15382 | 1/20 | 0.44 |
| ▸ | FOLH1 | Q04609 | 3/20 | 0.43 |
| ▸ | CDC25B | P30305 | 1/20 | 0.42 |
| ▸ | ATM | Q13315 | 1/20 | 0.42 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.42 |
| ▸ | MEN1 | O00255 | 3/20 | 0.41 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.41 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.41 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.41 |
| ▸ | POLB | P06746 | 1/20 | 0.41 |
| ▸ | THRB | P10828 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7458970 | 0.94 | HNF4A (0.56) | HNF4AFABP3FABP4FABP5ALDH1A1 | |
| Biphenyl SCHEMBL11750014 | 0.93 | HNF4A (0.54) | HNF4AFABP3FABP4FABP5ALDH1A1 | |
| SCHEMBL2748060 | 0.90 | HNF4A (0.53) | HNF4AFABP3FABP4FABP5ALDH1A1 | |
| SCHEMBL2141285 | 0.90 | ALDH1A1 (0.50) | HNF4AALDH1A1MAPTLMNAMYC | |
| SCHEMBL10712040 | 0.88 | ALDH1A1 (0.49) | HNF4AALDH1A1MAPTLMNAMYC | |
| SCHEMBL21486 | 0.86 | HNF4A (0.52) | HNF4AFABP3FABP4FABP5ALDH1A1 | |
| SCHEMBL36146 | 0.86 | HNF4A (0.66) | HNF4AFABP3FABP4FABP5ALDH1A1 | |
| SCHEMBL29376910 | 0.86 | HNF4A (0.66) | HNF4AFABP3FABP4FABP5ALDH1A1 | |
| Benzoic Acid SCHEMBL5568856 | 0.85 | HNF4A (0.47) | HNF4AFABP3FABP4FABP5ALDH1A1 | |
| Hydrochloric Acid SCHEMBL993304 | 0.84 | HNF4A (0.63) | HNF4AFABP3FABP4FABP5ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110105572-A | Material used in polyimide precursor, polyimides and its preparation | 宇部兴产株式会社 | 2019-08-09 | — | — | CN | claimed |
| EP-2216369-B1 | SEMIELECTROCONDUCTIVE POLYIMIDE RESIN BELT AND PROCESS FOR PRODUCING SEMIELECTROCONDUCTIVE POLYIMIDE RESIN BELT | GUNZE KK (JP) | 2015-03-25 | — | — | EP | claimed |
| US-8506848-B2 | Semielectroconductive polyimide resin belt and process for producing semielectroconductive polyimide resin belt | GUNZE LIMITED (JP) | 2013-08-13 | — | — | US | claimed |
| US-20100329751-A1 | SEMIELECTROCONDUCTIVE POLYIMIDE RESIN BELT AND PROCESS FOR PRODUCING SEMIELECTROCONDUCTIVE POLYIMIDE RESIN BELT | GUNZE LIMITED (JP) | 2010-12-30 | — | — | US | claimed |
| EP-2216369-A1 | SEMIELECTROCONDUCTIVE POLYIMIDE RESIN BELT AND PROCESS FOR PRODUCING SEMIELECTROCONDUCTIVE POLYIMIDE RESIN BELT | Gunze Limited (JP) | 2010-08-11 | — | — | EP | claimed |
| JP-63010629-A | — | — | None | — | — | JP | disclosed |
| US-12034021-B2 | Structure, composition for near-infrared cut filter, dry film, method for producing structure, optical sensor, and image display device | FUJIFILM CORPORATION (JP) | 2024-07-09 | — | — | US | disclosed |
| US-11982939-B2 | Composition, film, dry film, pattern forming method, near-infrared transmitting filter, structure, optical sensor, and image display device | FUJIFILM CORPORATION (JP) | 2024-05-14 | — | — | US | disclosed |
| EP-4273624-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, INTERLAYER INSULATING FILM, SURFACE PROTECTION FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-11-08 | — | — | EP | disclosed |
| US-20230350294-A1 | Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-11-02 | — | — | US | disclosed |
| CN-114502658-A | Resin composition, resin film, laminate, coverlay film, resin-containing copper foil, metal-clad laminate, and circuit board | 日铁化学材料株式会社 | 2022-05-13 | — | — | CN | disclosed |
| CN-114316792-A | Resin composition, resin film, laminate, coverlay film, resin-containing copper foil, metal-clad laminate, and circuit board | 日铁化学材料株式会社 | 2022-04-12 | — | — | CN | disclosed |
| US-8506848-B2 | Semielectroconductive polyimide resin belt and process for producing semielectroconductive polyimide resin belt | GUNZE LIMITED (JP) | 2013-08-13 | — | — | US | disclosed |
| US-20100329751-A1 | SEMIELECTROCONDUCTIVE POLYIMIDE RESIN BELT AND PROCESS FOR PRODUCING SEMIELECTROCONDUCTIVE POLYIMIDE RESIN BELT | GUNZE LIMITED (JP) | 2010-12-30 | — | — | US | disclosed |
| US-20100329751-A1 | SEMIELECTROCONDUCTIVE POLYIMIDE RESIN BELT AND PROCESS FOR PRODUCING SEMIELECTROCONDUCTIVE POLYIMIDE RESIN BELT | GUNZE LIMITED (JP) | 2010-12-30 | — | — | US | disclosed |
| EP-2216369-A1 | SEMIELECTROCONDUCTIVE POLYIMIDE RESIN BELT AND PROCESS FOR PRODUCING SEMIELECTROCONDUCTIVE POLYIMIDE RESIN BELT | Gunze Limited (JP) | 2010-08-11 | — | — | EP | disclosed |
| EP-2216369-A1 | SEMIELECTROCONDUCTIVE POLYIMIDE RESIN BELT AND PROCESS FOR PRODUCING SEMIELECTROCONDUCTIVE POLYIMIDE RESIN BELT | Gunze Limited (JP) | 2010-08-11 | — | — | EP | disclosed |
| WO-2009069715-A1 | SEMIELECTROCONDUCTIVE POLYIMIDE RESIN BELT AND PROCESS FOR PRODUCING SEMIELECTROCONDUCTIVE POLYIMIDE RESIN BELT | GUNZE LIMITED (JP) | 2009-06-04 | — | — | WO | disclosed |
| EP-0718696-B1 | Photosensitive polyimide precursor composition | ASAHI CHEMICAL IND (JP) | 2002-01-16 | — | — | EP | disclosed |
| JP-S6310629-A | NOVEL POLYAMIC ACID OR POLYAMIC ESTER AND NOVEL POLYIMIDE | HITACHI CHEM CO LTD | 1988-01-18 | — | — | JP | disclosed |