SCHEMBL2904670

SCHEMBL2904670

Oc1ccc(Oc2ccc(Oc3ccc(O)cc3)nn2)cc1

nearest known ligand 0.62

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 3/20 0.62
KMT2A Q03164 3/20 0.62
ESR2 Q92731 2/20 0.62
ESR1 P03372 1/20 0.62
LTA4H P09960 6/20 0.52
NR1H2 P55055 1/20 0.52
BAX Q07812 1/20 0.52
BCAT2 O15382 1/20 0.47
PARP10 Q53GL7 1/20 0.43
GAA P10253 1/20 0.41
NR2F2 P24468 1/20 0.41
OPRM1 P35372 1/20 0.41
OPRD1 P41143 1/20 0.41
HTT P42858 1/20 0.41
KDM4E B2RXH2 1/20 0.40
NPC1 O15118 1/20 0.40
CA12 O43570 1/20 0.40
GMNN O75496 1/20 0.40
ALDH1A1 P00352 1/20 0.40
CA1 P00915 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2901613 0.93 ESR2 (0.54) MEN1KMT2AESR2ESR1LTA4H
SCHEMBL10626156 0.88 MEN1 (0.48) MEN1KMT2AESR2ESR1LTA4H
Phenol SCHEMBL5710589 0.84 BCAT2 (0.62) MEN1KMT2AESR2ESR1LTA4H
SCHEMBL2906030 0.81 MEN1 (0.45) MEN1KMT2AESR2ESR1KDM4E
SCHEMBL5686802 0.79 MEN1 (0.48) MEN1KMT2AESR2ESR1LTA4H
SCHEMBL5687024 0.79 MEN1 (0.48) MEN1KMT2AESR2ESR1LTA4H
SCHEMBL7811939 0.78 ESR2 (1.00) MEN1KMT2AESR2ESR1LTA4H
SCHEMBL249169 0.78 ESR2 (1.00) MEN1KMT2AESR2ESR1LTA4H
SCHEMBL18198 0.78 ESR2 (1.00) MEN1KMT2AESR2ESR1LTA4H
SCHEMBL3175106 0.78 ESR2 (1.00) MEN1KMT2AESR2ESR1LTA4H

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1636209-B1 EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT SUMITOMO CHEMICAL CO (JP) 2010-08-11 EP disclosed
US-7279574-B2 Epoxy compound and cured epoxy resin product SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2007-10-09 US disclosed
US-20060159929-A1 Epoxy compound and cured epoxy resin product HITACHI, LTD. (JP) 2006-07-20 US disclosed