SCHEMBL5686802

SCHEMBL5686802

Oc1ccc(Oc2ccnnn2)cc1

nearest known ligand 0.48

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 2/20 0.48
KMT2A Q03164 2/20 0.48
ESR2 Q92731 2/20 0.48
ESR1 P03372 1/20 0.48
LTA4H P09960 6/20 0.42
NR1H2 P55055 1/20 0.42
BAX Q07812 1/20 0.42
PARP10 Q53GL7 1/20 0.36
MAPK1 P28482 1/20 0.34
GAA P10253 1/20 0.33
NR2F2 P24468 1/20 0.33
OPRM1 P35372 1/20 0.33
OPRD1 P41143 1/20 0.33
HTT P42858 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5687361 0.86 CYP1A2 (0.38) MEN1KMT2AESR2ESR1
SCHEMBL5586068 0.81 ALDH1A1 (0.48) MEN1KMT2APARP10MAPK1GAA
SCHEMBL108194 0.80 BCAT2 (0.50) MEN1KMT2ALTA4HNR1H2BAX
SCHEMBL2904670 0.79 MEN1 (0.62) MEN1KMT2AESR2ESR1LTA4H
SCHEMBL8517767 0.79 CYP3A4 (0.39) MEN1KMT2AHTT
SCHEMBL26556 0.79 MEN1 (0.31) MEN1KMT2AHTT
SCHEMBL5687024 0.77 MEN1 (0.48) MEN1KMT2AESR2ESR1LTA4H
SCHEMBL28026591 0.74 HAO1 (0.50) MEN1KMT2AMAPK1GAAHTT
SCHEMBL2901613 0.74 ESR2 (0.54) MEN1KMT2AESR2ESR1LTA4H
SCHEMBL4074002 0.72 CA2 (0.46)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110079218-A Adhesive and correlation technique 艾利丹尼森公司 2019-08-02 CN disclosed
CN-105051134-B Adhesives and Related Methods 艾利丹尼森公司 2019-05-07 CN disclosed
CN-109439206-A Adhesive and correlation technique 艾利丹尼森公司 2019-03-08 CN disclosed
CN-106471086-A Cohesive failure non-contaminating hot melt adhesive 波士胶公司 2017-03-01 CN disclosed
EP-1636209-A1 EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT Sumitomo Chemical Company, Limited (JP) 2006-03-22 EP disclosed
WO-2004113327-A1 EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2004-12-29 WO disclosed