SCHEMBL2906382

SCHEMBL2906382

CC(C)(C)CC(C)(C)Nc1nc(Br)nc(Br)n1

nearest known ligand 0.35

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
NPSR1 Q6W5P4 1/20 0.35
MEN1 O00255 1/20 0.35
KMT2A Q03164 1/20 0.35
LATS1 O95835 1/20 0.34
LATS2 Q9NRM7 1/20 0.34
MAPT P10636 2/20 0.31
TP53 P04637 1/20 0.31
POLB P06746 1/20 0.31
SMN1; SMN2 Q16637 2/20 0.30
LMNA P02545 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4303475 0.84 SMN1; SMN2 (0.41) NPSR1MEN1KMT2ALATS1LATS2
SCHEMBL13588261 0.77 NPSR1 (0.33) NPSR1MEN1KMT2ALATS1LATS2
SCHEMBL5671532 0.77 MEN1 (0.36) NPSR1MEN1KMT2ALATS1LATS2
SCHEMBL10603016 0.75 MEN1 (0.35) NPSR1MEN1KMT2ALATS1LATS2
SCHEMBL11617310 0.75 NPSR1 (0.32) NPSR1MEN1KMT2ALATS1LATS2
SCHEMBL7870521 0.71 LATS1 (0.34) NPSR1LATS1LATS2MAPTSMN1; SMN2
SCHEMBL9917150 0.69 LMNA (0.47) NPSR1KMT2AMAPTSMN1; SMN2LMNA
SCHEMBL2782401 0.67
SCHEMBL4820808 0.67 LATS1 (0.34) LATS1LATS2POLB
SCHEMBL2906390 0.66 GAA (0.40) NPSR1MEN1KMT2AMAPTTP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1636209-B1 EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT SUMITOMO CHEMICAL CO (JP) 2010-08-11 EP disclosed
US-7279574-B2 Epoxy compound and cured epoxy resin product SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2007-10-09 US disclosed
US-20060159929-A1 Epoxy compound and cured epoxy resin product HITACHI, LTD. (JP) 2006-07-20 US disclosed
EP-1636209-A1 EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT Sumitomo Chemical Company, Limited (JP) 2006-03-22 EP disclosed
WO-2004113327-A1 EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2004-12-29 WO disclosed
US-4981964-A PHOTOSTABILIZERS ICI AMERICAS INC. (US) 1991-01-01 US disclosed
EP-0373839-A1 Oligomeric polyesters and polyamides containing dipiperidyl triazine groups ICI AMERICAS INC. (US) 1990-06-20 EP disclosed