SCHEMBL29131791

SCHEMBL29131791

Cc1cc(C)c(CSc2cc(C)c(O)c(C)c2)c(C)c1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 4/20 0.41
GAA P10253 2/20 0.41
ALDH1A1 P00352 2/20 0.41
LMNA P02545 2/20 0.41
KDM4E B2RXH2 1/20 0.41
CA1 P00915 2/20 0.40
CA2 P00918 2/20 0.40
CA12 O43570 1/20 0.40
CA7 P43166 1/20 0.40
CA13 Q8N1Q1 1/20 0.40
MEN1 O00255 5/20 0.39
KMT2A Q03164 5/20 0.39
NPC1 O15118 1/20 0.36
ESR1 P03372 1/20 0.35
ESR2 Q92731 1/20 0.35
PTGS1 P23219 3/20 0.34
PTGS2 P35354 3/20 0.34
NR3C1 P04150 1/20 0.34
PGR P06401 1/20 0.34
NR3C2 P08235 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3650882 0.84 CA1 (0.41) MAPTGAAALDH1A1CA1CA2
SCHEMBL10126437 0.79 RAPGEF4 (0.40) MAPTGAAALDH1A1LMNAKDM4E
Methylamine SCHEMBL18641326 0.73 ALDH1A1 (0.67) MAPTGAAALDH1A1LMNAKDM4E
SCHEMBL36529 0.73 ALDH1A1 (0.65) MAPTGAAALDH1A1LMNAKDM4E
SCHEMBL27800318 0.73 ALDH1A1 (0.65) MAPTGAAALDH1A1LMNAKDM4E
SCHEMBL3902576 0.72 MEN1 (0.49) ALDH1A1MEN1KMT2ANPC1PTGS1
SCHEMBL28823626 0.71 ALDH1A1 (0.62) MAPTGAAALDH1A1LMNAKDM4E
SCHEMBL29065596 0.71 ALDH1A1 (0.62) MAPTGAAALDH1A1LMNAKDM4E
Water SCHEMBL28440240 0.71 ALDH1A1 (0.62) MAPTGAAALDH1A1LMNAKDM4E
SCHEMBL29444859 0.71 ALDH1A1 (0.62) MAPTGAAALDH1A1LMNAKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117099045-A Negative photosensitive resin composition, cured product, laminate, method for producing cured product, and semiconductor device 富士胶片株式会社 2023-11-21 CN disclosed