Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 | P00915 | 1/20 | 0.41 |
| ▸ | CA2 | P00918 | 1/20 | 0.41 |
| ▸ | MEN1 | O00255 | 4/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 4/20 | 0.38 |
| ▸ | NPC1 | O15118 | 1/20 | 0.38 |
| ▸ | ESR1 | P03372 | 1/20 | 0.38 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.38 |
| ▸ | SLC11A2 | P49281 | 1/20 | 0.36 |
| ▸ | PTGS1 | P23219 | 5/20 | 0.32 |
| ▸ | PTGS2 | P35354 | 5/20 | 0.32 |
| ▸ | PGK1 | P00558 | 1/20 | 0.31 |
| ▸ | PGK2 | P07205 | 1/20 | 0.31 |
| ▸ | DAO | P14920 | 1/20 | 0.31 |
| ▸ | MAPT | P10636 | 1/20 | 0.31 |
| ▸ | XBP1 | P17861 | 1/20 | 0.31 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.31 |
| ▸ | ALOX5 | P09917 | 3/20 | 0.31 |
| ▸ | ACHE | P22303 | 1/20 | 0.31 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.31 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29131791 | 0.84 | MAPT (0.41) | CA1CA2MEN1KMT2ANPC1 | |
| SCHEMBL3902576 | 0.75 | MEN1 (0.49) | MEN1KMT2ANPC1PTGS1PTGS2 | |
| SCHEMBL9193227 | 0.71 | CA1 (0.41) | CA1CA2MEN1KMT2ANPC1 | |
| SCHEMBL8573268 | 0.71 | CA1 (0.41) | CA1CA2MEN1KMT2ANPC1 | |
| SCHEMBL11871644 | 0.69 | CA1 (0.39) | CA1CA2MEN1KMT2ANPC1 | |
| SCHEMBL17285639 | 0.69 | MEN1 (0.51) | CA1CA2MEN1KMT2ANPC1 | |
| SCHEMBL11145079 | 0.69 | CA2 (0.40) | CA1CA2MEN1KMT2ANPC1 | |
| SCHEMBL201332 | 0.69 | THRB (0.47) | CA1CA2MEN1KMT2ANPC1 | |
| SCHEMBL70958 | 0.69 | CA1 (0.55) | CA1CA2MEN1KMT2ANPC1 | |
| SCHEMBL8668939 | 0.69 | CA1 (0.55) | CA1CA2MEN1KMT2ANPC1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 108 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20090081589-A1 | THICK FILM RESISTS | MERCK PATENT GMBH (DE) | 2009-03-26 | — | — | US | claimed |
| EP-4702010-A1 | PHOTOACTIVE COMPOUNDS | Merck Patent GmbH (DE) | 2026-03-04 | — | — | EP | disclosed |
| US-20250376552-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2025-12-11 | — | — | US | disclosed |
| US-20250264801-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-08-21 | — | — | US | disclosed |
| EP-4597225-A1 | FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4596607-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4596608-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| US-20250236697-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-07-24 | — | — | US | disclosed |
| US-20250230283-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-07-17 | — | — | US | disclosed |
| CN-120077104-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2025-05-30 | — | — | CN | disclosed |
| US-5529881-A | ALKALI-SOLUBLE RESIN AND 1,2-NAPHTHOQUINONEDIAZIDE SULFONIC ACID ESTER OF SPECIFIED POLYHYDROXY COMPOUND AS PHOTOSENSITIVE COMPOUND | FUJI PHOTO FILM CO., LTD. (JP) | 1996-06-25 | — | — | US | disclosed |
| US-5523396-A | ESTERIFICATION OF POLYHYDROXY COMPOUND WITH 1,2-NAPHTHOQUINONEDIAZIDE-5-SULFONYL CHLORIDE IN THE PRESENCE OF A BASIC CATALYST | FUJI PHOTO FILM CO., LTD. (JP) | 1996-06-04 | — | — | US | disclosed |
| EP-0710886-A1 | Positive photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1996-05-08 | — | — | EP | disclosed |
| EP-0706089-A2 | Process for synthesizing quinonediazide ester and positive working photoresist containing the same | FUJI PHOTO FILM CO., LTD. (JP) | 1996-04-10 | — | — | EP | disclosed |
| US-5494773-A | MIXTURE WITH A 1,2-QUINONEDIAZIDE COMPOUND | FUJI PHOTO FILM CO., LTD. (JP) | 1996-02-27 | — | — | US | disclosed |
| EP-0684521-A1 | Positive working photosensitive compositions | FUJI PHOTO FILM CO., LTD. (JP) | 1995-11-29 | — | — | EP | disclosed |
| EP-0677789-A1 | Positive photoresist composition | Fuji Photo Film Co., Ltd. (JP) | 1995-10-18 | — | — | EP | disclosed |
| EP-0672952-A1 | Positive photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1995-09-20 | — | — | EP | disclosed |
| EP-0658807-A1 | Positive-working photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1995-06-21 | — | — | EP | disclosed |
| EP-0644460-A1 | Positive working photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1995-03-22 | — | — | EP | disclosed |