SCHEMBL29214710

SCHEMBL29214710

CCC(OCCOC(=O)C(=O)c1ccccc1)(C(=O)O)c1ccccc1

nearest known ligand 0.47

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
▸ ALDH1A1 P00352 1/20 0.43
▸ MAPT P10636 1/20 0.43
▸ LMNA P02545 1/20 0.41
▸ CES1 P23141 7/20 0.40
▸ CES2 O00748 6/20 0.40
▸ CHRM2 P08172 2/20 0.38
▸ CHRM1 P11229 2/20 0.38
▸ CHRM3 P20309 2/20 0.38
▸ CYP3A4 P08684 1/20 0.37
▸ CYP2D6 P10635 1/20 0.37
▸ CHRM4 P08173 1/20 0.36
▸ CHRM5 P08912 1/20 0.36
▸ TDP1 Q9NUW8 1/20 0.36
▸ CYP2C19 P33261 1/20 0.36
▸ HIF1A Q16665 1/20 0.36
▸ HPGD P15428 1/20 0.35
▸ MEN1 O00255 1/20 0.35
▸ POLB P06746 1/20 0.35
▸ KMT2A Q03164 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3683240 0.81 ALDH1A1 (0.38) ALDH1A1MAPTLMNACES1CES2
Hydrochloric Acid SCHEMBL6519090 0.80 CHRM2 (0.45) ALDH1A1MAPTLMNACHRM2CHRM1
SCHEMBL4738627 0.79 CES2 (0.56) ALDH1A1MAPTLMNACES1CES2
SCHEMBL20572583 0.79 ALDH1A1 (0.46) ALDH1A1MAPTLMNACES1CES2
SCHEMBL29214674 0.79 CHRM2 (0.40) ALDH1A1LMNACHRM2CHRM1CHRM3
SCHEMBL17653676 0.78 CYP2D6 (0.43) ALDH1A1MAPTLMNACES1CES2
SCHEMBL17653674 0.78 CYP2D6 (0.43) ALDH1A1MAPTLMNACES1CES2
SCHEMBL23457203 0.78 SMN1; SMN2 (0.37) ALDH1A1MAPTLMNACES1CES2
SCHEMBL7495006 0.78 KCNN4 (0.42) ALDH1A1MAPTCES1CES2CHRM2
SCHEMBL1119144 0.76 LMNA (0.67) ALDH1A1MAPTLMNACES1CES2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118073002-A Photosensitive conductive paste, method for producing laminated electronic component, and laminated electronic component 株式会社村田制作所 2024-05-24 — — CN disclosed
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