SCHEMBL29358768

SCHEMBL29358768

Cc1cc(C2(c3ccc(O)c(C)c3)c3ccccc3-c3ccccc32)ccc1O

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ ESR1 P03372 6/20 1.00
▸ ESR2 Q92731 5/20 1.00
▸ MEN1 O00255 5/20 0.59
▸ KMT2A Q03164 5/20 0.59
▸ MAPT P10636 4/20 0.59
▸ LMNA P02545 3/20 0.59
▸ SMN1; SMN2 Q16637 2/20 0.59
▸ TDP1 Q9NUW8 2/20 0.59
▸ NPSR1 Q6W5P4 2/20 0.59
▸ L3MBTL1 Q9Y468 2/20 0.59
▸ POLB P06746 2/20 0.59
▸ XBP1 P17861 1/20 0.59
▸ KDM4E B2RXH2 2/20 0.47
▸ OPRK1 P41145 1/20 0.47
▸ TP53 P04637 1/20 0.41
▸ PDE10A Q9Y233 1/20 0.38
▸ ALDH1A1 P00352 2/20 0.38
▸ CYP1A2 P05177 1/20 0.38
▸ CYP3A4 P08684 1/20 0.38
▸ CYP2D6 P10635 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL70957 1.00 ESR1 (1.00) ESR1ESR2MEN1KMT2AMAPT
SCHEMBL29450641 1.00 ESR1 (1.00) ESR1ESR2MEN1KMT2AMAPT
SCHEMBL15691554 0.98 ESR1 (0.97) ESR1ESR2MEN1KMT2AMAPT
SCHEMBL12084149 0.97 ESR1 (0.93) ESR1ESR2MEN1KMT2AMAPT
SCHEMBL12387987 0.95 ESR1 (0.90) ESR1ESR2MEN1KMT2AMAPT
SCHEMBL18386002 0.95 ESR1 (0.90) ESR1ESR2MEN1KMT2AMAPT
SCHEMBL6208231 0.94 ESR1 (0.88) ESR1ESR2MEN1KMT2AMAPT
SCHEMBL10697013 0.94 ESR1 (0.88) ESR1ESR2MEN1KMT2AMAPT
SCHEMBL17399575 0.94 ESR1 (0.88) ESR1ESR2MEN1KMT2AMAPT
SCHEMBL23986561 0.90 ESR1 (0.82) ESR1ESR2MEN1KMT2AMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 523 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12359076-B2 Water-soluble resin for printing KAO CORPORATION (JP) 2025-07-15 — — US claimed
CN-119039502-A Cyclization strategy induced intrinsic long-life room temperature phosphorescent material and preparation method thereof 重庆理工大学 2024-11-29 — — CN claimed
EP-3632966-B1 SHEET FORMED FROM CARBON FIBER REINFORCED THERMOPLASTIC RESIN, AND PRODUCTION METHOD OF SAID SHEET MITSUBISHI GAS CHEMICAL CO (JP) 2024-07-31 — — EP claimed
CN-117736072-A Synthesis method of 9, 9-bis (4-hydroxy-3-methylphenyl) fluorene 中唯炼焦技术国家工程研究中心有限责任公司 2024-03-22 — — CN claimed
CN-116348529-A Polycarbonate resin composition and circuit molded article for communication device 帝人株式会社 2023-06-27 — — CN claimed
EP-4177291-A1 METHODS FOR PRODUCING POLYCARBONATE COPOLYMER AND POLYSILOXANE COMPOUND, POLYCARBONATE COPOLYMER, POLYSILOXANE COMPOUND, COMPOSITION, AND MOLDED BODY MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-05-10 — — EP claimed
EP-4177293-A1 METHODS FOR PRODUCING POLYCARBONATE COPOLYMER AND POLYSILOXANE COMPOUND, POLYCARBONATE COPOLYMER, POLYSILOXANE COMPOUND, COMPOSITION, AND MOLDED BODY MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-05-10 — — EP claimed
CN-113423757-B Polycarbonate resin composition or copolymer, and optical film 帝人株式会社 2023-04-04 — — CN claimed
US-20220348714-A1 BENDING-RESISTANT POLYESTER FILM AND THE PRODUCTION METHOD THEREOF SHINKONG SYNTHETIC FIBERS CORPORATION (TW) 2022-11-03 — — US claimed
US-20220315778-A1 WATER-SOLUBLE RESIN FOR PRINTING KAO CORPORATION (JP) 2022-10-06 — — US claimed
WO-2022075328-A1 POLYCARBONATE RESIN COMPOSITION AND CIRCUIT MOLDED ARTICLE FOR COMMUNICATION DEVICES 帝人株式会社 2022-04-14 — — WO claimed
EP-4747233-A2 COMPOUNDS, COMPOSITIONS CONTAINING COMPOUNDS, AND METHODS OF MANUFACTURING RESIST MEMBRANES Merck Patent GmbH (DE) 2026-05-27 — — EP disclosed
CN-122071610-A Resin composition and use thereof 台燿科技股份有限公司 2026-05-22 — — CN disclosed
WO-2026105863-A1 BIFUNCTIONAL COMPOUND AND METHOD FOR PRODUCING BIFUNCTIONAL COMPOUND 三菱瓦斯化学株式会社 2026-05-21 — — WO disclosed
WO-2026105862-A1 BIFUNCTIONAL COMPOUND, COMPOUND, METHOD FOR PRODUCING COMPOUND, AND METHOD FOR PRODUCING BIFUNCTIONAL COMPOUND 三菱瓦斯化学株式会社 2026-05-21 — — WO disclosed
US-11248086-B2 Hard-mask forming composition and method for manufacturing electronic component TOKYO OHKA KOGYO CO., LTD. (JP) 2022-02-15 — — US disclosed
EP-3950835-A1 RESIN COMPOSITION Kao Corporation (JP) 2022-02-09 — — EP disclosed
EP-3950836-A1 RESIN COMPOSITION Kao Corporation (JP) 2022-02-09 — — EP disclosed
CN-114026175-A Thermoplastic resin composition 帝人株式会社 2022-02-08 — — CN disclosed
EP-3943987-A1 ANTI-REFLECTION FILM LAMINATE, ANTI-REFLECTION FILM, AND METHOD FOR MANUFACTURING ANTI-REFLECTION FILM LAMINATE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-01-26 — — EP disclosed
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