SCHEMBL29366288

SCHEMBL29366288

O=C(c1ccc(O)cc1)c1ccc(O)c(O)c1O

nearest known ligand 0.71

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC1 Q13547 1/20 0.66
MAPT P10636 6/20 0.61
HPGD P15428 5/20 0.61
ALDH1A1 P00352 4/20 0.61
KDM4E B2RXH2 3/20 0.61
RECQL P46063 3/20 0.61
HSD17B10 Q99714 3/20 0.61
LMNA P02545 3/20 0.61
TDP1 Q9NUW8 2/20 0.61
MAPK1 P28482 2/20 0.61
CYP3A4 P08684 1/20 0.61
ALOX15 P16050 2/20 0.60
LIG1 P18858 1/20 0.57
ESR1 P03372 1/20 0.56
ESR2 Q92731 1/20 0.56
PKM P14618 1/20 0.56
HTT P42858 1/20 0.56
SELL P14151 1/20 0.54
SELP P16109 1/20 0.54
MEN1 O00255 4/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL93340 1.00 HDAC1 (0.66) HDAC1MAPTHPGDALDH1A1KDM4E
SCHEMBL3656665 0.94 HDAC1 (0.73) HDAC1MAPTHPGDALDH1A1KDM4E
SCHEMBL8861471 0.93 MEN1 (0.61) HDAC1MAPTHPGDALDH1A1KDM4E
SCHEMBL6568212 0.91 LIG1 (0.62) HDAC1MAPTHPGDALDH1A1KDM4E
SCHEMBL30063629 0.86 LIG1 (0.71) HDAC1MAPTHPGDALDH1A1KDM4E
SCHEMBL1947873 0.86 LIG1 (0.71) HDAC1MAPTHPGDALDH1A1KDM4E
SCHEMBL5689404 0.85 MEN1 (0.76) HDAC1MAPTHPGDALDH1A1KDM4E
SCHEMBL6568215 0.85 HDAC1 (0.58) HDAC1MAPTHPGDALDH1A1KDM4E
SCHEMBL28033673 0.85 MAPT (0.51) HDAC1MAPTHPGDALDH1A1KDM4E
SCHEMBL2053270 0.85 HDAC1 (0.58) HDAC1MAPTHPGDALDH1A1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 81 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2026107261-A1 PURIFICATION OF PHOTORESIST POLYMER BY SURFACE-MODIFIED POROUS POLYETHYLENE MEMBRANE ENTEGRIS, INC. (US) 2026-05-21 WO claimed
WO-2024128554-A1 METHOD FOR PREPARING CARBON DIOXIDE-EPOXIDE REACTION CATALYST, CARBON DIOXIDE-EPOXIDE REACTION CATALYST, AND POLYMER SYNTHESIS METHOD 아주대학교산학협력단 2024-06-20 WO claimed
CN-115933334-A Positive photoresist capable of developing reverse trapezoidal morphology, and preparation method and application thereof 深圳市容大感光科技股份有限公司 2023-04-07 CN claimed
CN-115745917-A Long-acting ultraviolet absorbent and preparation method and application thereof 宁波家联科技股份有限公司 2023-03-07 CN claimed
CN-114859676-A Photoetching method for improving resolution of positive photoresist thick film 明士(北京)新材料开发有限公司 2022-08-05 CN claimed
WO-2022142537-A1 FLUORINE-CONTAINING RESIN COMPOSITION, PREPARATION METHOD THEREFOR, AND PREPARATION METHOD FOR CURED FILM CONTAINING SAME 西安瑞联新材料股份有限公司 2022-07-07 WO claimed
WO-2022115112-A1 THREE-DIMENSIONAL PRINTING HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2022-06-02 WO claimed
CN-114478930-A Preparation method of polybutadiene latex and prepared ABS resin 万华化学集团股份有限公司 2022-05-13 CN claimed
CN-109824491-B Production method of 2,3,4, 4' -tetrahydroxybenzophenone 三峡大学 2022-03-08 CN claimed
CN-114137795-A Photoresist composition and application thereof 广东粤港澳大湾区黄埔材料研究院 2022-03-04 CN claimed
WO-2026107261-A1 PURIFICATION OF PHOTORESIST POLYMER BY SURFACE-MODIFIED POROUS POLYETHYLENE MEMBRANE ENTEGRIS, INC. (US) 2026-05-21 WO disclosed
EP-4558546-A1 PHOTOCURABLE HYDROGEL COMPOSITIONS Tympanogen, Inc. (US) 2025-05-28 EP disclosed
CN-119528709-A Polycarbonyl enol compound, preparation method thereof and application thereof in photoinitiator synthesis 湖北三峡实验室 2025-02-28 CN disclosed
CN-119511634-A Photoresist composition modification method 湖北三峡实验室 2025-02-25 CN disclosed
US-20240398873-A1 Amniotic Membrane Hydrogel and Methods of Making UNIV WAKE FOREST HEALTH SCIENCES (US) 2024-12-05 US disclosed
CN-106715597-B Resin composition, method for producing heat-resistant resin film, and display device 东丽株式会社 2022-03-01 CN disclosed
CN-109415513-B Silicon-rich silsesquioxane resins 美国陶氏有机硅公司 2022-02-25 CN disclosed
CN-108139671-B Photosensitive resin composition and cured film prepared therefrom 罗门哈斯电子材料韩国有限公司 2022-02-11 CN disclosed
CN-107179652-B Positive photosensitive polysiloxane composition and application thereof 奇美实业股份有限公司 2022-02-08 CN disclosed
CN-113994256-A Method for forming EUV patterned resist 亚历克斯·P·G·罗宾逊 2022-01-28 CN disclosed