SCHEMBL29375732

SCHEMBL29375732

Oc1ccc(C(c2ccc(O)c(C3CCCCC3)c2)c2ccc(O)c(C3CCCCC3)c2)cc1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ NUDT1 P36639 1/20 0.48
▸ BACE1 P56817 1/20 0.48
▸ HSP90AA1 P07900 1/20 0.48
▸ ACMSD Q8TDX5 2/20 0.36
▸ THRB P10828 1/20 0.36
▸ ESR2 Q92731 3/20 0.36
▸ ESR1 P03372 2/20 0.36
▸ HIF1A Q16665 1/20 0.35
▸ HSD17B10 Q99714 1/20 0.35
▸ MIF P14174 1/20 0.34
▸ DEGS1 O15121 1/20 0.33
▸ MAPT P10636 2/20 0.33
▸ KMT2A Q03164 2/20 0.33
▸ ALDH1A1 P00352 1/20 0.33
▸ KDM4E B2RXH2 1/20 0.32
▸ MEN1 O00255 1/20 0.32
▸ HSP90AB1 P08238 1/20 0.32
▸ HDAC4 P56524 1/20 0.32
▸ HDAC2 Q92769 1/20 0.32
▸ HDAC8 Q9BY41 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL761682 1.00 NUDT1 (0.48) NUDT1BACE1HSP90AA1ACMSDTHRB
SCHEMBL2861169 0.89 NUDT1 (0.47) NUDT1BACE1HSP90AA1ACMSDTHRB
SCHEMBL2201799 0.89 NUDT1 (0.49) NUDT1BACE1HSP90AA1ACMSDTHRB
SCHEMBL2858575 0.88 NUDT1 (0.46) NUDT1BACE1HSP90AA1ACMSDTHRB
SCHEMBL29376176 0.86 NUDT1 (0.44) NUDT1BACE1HSP90AA1ESR2ESR1
SCHEMBL30899189 0.86 NUDT1 (0.44) NUDT1BACE1HSP90AA1ESR2ESR1
SCHEMBL761321 0.86 NUDT1 (0.44) NUDT1BACE1HSP90AA1ESR2ESR1
SCHEMBL27675462 0.86 NUDT1 (0.44) NUDT1BACE1HSP90AA1ESR2ESR1
SCHEMBL19685091 0.85 NUDT1 (0.39) NUDT1BACE1HSP90AA1ACMSDTHRB
SCHEMBL2868233 0.85 HSP90AA1 (0.43) NUDT1BACE1HSP90AA1ACMSDTHRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119575759-A Positive photosensitive resin composition, photosensitive film, resist underlayer film, resist permanent film, and method for producing film DIC株式会社 2025-03-07 — — CN disclosed
CN-118672058-A Photosensitive resin composition, resist film, resist underlayer film, and resist permanent film DIC株式会社 2024-09-20 — — CN disclosed
CN-116209690-B Phenolic hydroxyl group-containing resin, resin composition for alkali-developable resist, resist-curable resin composition, and method for producing phenolic hydroxyl group-containing resin DIC株式会社 2024-09-06 — — CN disclosed
CN-118325004-A Phenolic hydroxyl group-containing resin, photosensitive resin composition, curable composition, and resist film DIC株式会社 2024-07-12 — — CN disclosed
CN-114902135-B Positive photosensitive resin composition, cured film, and resist film DIC株式会社 2024-07-02 — — CN disclosed
CN-113348188-B Phenolic hydroxyl group-containing resin, photosensitive composition, resist film, curable composition, and cured product DIC株式会社 2024-05-10 — — CN disclosed
CN-117321109-A Phenolic hydroxyl group-containing resin DIC株式会社 2023-12-29 — — CN disclosed
CN-113227181-B Resist composition DIC株式会社 2023-07-18 — — CN disclosed
CN-116430671-A Photoresist composition and photoetching process 上海飞凯材料科技股份有限公司 2023-07-14 — — CN disclosed
CN-110959138-B Resist material DIC株式会社 2023-06-30 — — CN disclosed
CN-108693710-B Positive photosensitive polysiloxane composition 奇美实业股份有限公司 2022-12-02 — — CN disclosed
WO-2022239597-A1 RESIN CONTAINING PHENOLIC HYDROXYL GROUP DIC株式会社 2022-11-17 — — WO disclosed
CN-107561863-B Positive photosensitive resin composition and application thereof 奇美实业股份有限公司 2022-09-16 — — CN disclosed
CN-114902135-A Positive photosensitive resin composition, cured film and resist film DIC株式会社 2022-08-12 — — CN disclosed
CN-107870516-B Positive photosensitive resin composition, patterned film and method for manufacturing bump 奇美实业股份有限公司 2022-08-02 — — CN disclosed
CN-114326300-A Positive photoresist composition, preparation method and photoresist pattern forming method 上海飞凯材料科技股份有限公司 2022-04-12 — — CN disclosed
WO-2022065041-A1 RESIN CONTAINING PHENOLIC HYDROXYL GROUP, RESIN COMPOSITION FOR ALKALI-DEVELOPABLE RESISTS, RESIST CURABLE RESIN COMPOSITION, AND METHOD FOR PRODUCING RESIN CONTAINING PHENOLIC HYDROXYL GROUP DIC株式会社 2022-03-31 — — WO disclosed
WO-2022059448-A1 METHOD FOR PRODUCING RESIST PATTERN, RESIST PATTERN AND POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR PRODUCTION OF TRANSPARENT MULTILAYER MEMBER DIC株式会社 2022-03-24 — — WO disclosed
CN-107703685-B Laminate and method for producing laminate 东京应化工业株式会社 2022-03-18 — — CN disclosed
CN-107179652-B Positive photosensitive polysiloxane composition and application thereof 奇美实业股份有限公司 2022-02-08 — — CN disclosed
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