Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NUDT1 | P36639 | 1/20 | 0.48 |
| ▸ | BACE1 | P56817 | 1/20 | 0.48 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.48 |
| ▸ | ACMSD | Q8TDX5 | 2/20 | 0.36 |
| ▸ | THRB | P10828 | 1/20 | 0.36 |
| ▸ | ESR2 | Q92731 | 3/20 | 0.36 |
| ▸ | ESR1 | P03372 | 2/20 | 0.36 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.35 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.35 |
| ▸ | MIF | P14174 | 1/20 | 0.34 |
| ▸ | DEGS1 | O15121 | 1/20 | 0.33 |
| ▸ | MAPT | P10636 | 2/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.32 |
| ▸ | MEN1 | O00255 | 1/20 | 0.32 |
| ▸ | HSP90AB1 | P08238 | 1/20 | 0.32 |
| ▸ | HDAC4 | P56524 | 1/20 | 0.32 |
| ▸ | HDAC2 | Q92769 | 1/20 | 0.32 |
| ▸ | HDAC8 | Q9BY41 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29375732 | 1.00 | NUDT1 (0.48) | NUDT1BACE1HSP90AA1ACMSDTHRB | |
| SCHEMBL2861169 | 0.89 | NUDT1 (0.47) | NUDT1BACE1HSP90AA1ACMSDTHRB | |
| SCHEMBL2201799 | 0.89 | NUDT1 (0.49) | NUDT1BACE1HSP90AA1ACMSDTHRB | |
| SCHEMBL2858575 | 0.88 | NUDT1 (0.46) | NUDT1BACE1HSP90AA1ACMSDTHRB | |
| SCHEMBL29376176 | 0.86 | NUDT1 (0.44) | NUDT1BACE1HSP90AA1ESR2ESR1 | |
| SCHEMBL30899189 | 0.86 | NUDT1 (0.44) | NUDT1BACE1HSP90AA1ESR2ESR1 | |
| SCHEMBL761321 | 0.86 | NUDT1 (0.44) | NUDT1BACE1HSP90AA1ESR2ESR1 | |
| SCHEMBL27675462 | 0.86 | NUDT1 (0.44) | NUDT1BACE1HSP90AA1ESR2ESR1 | |
| SCHEMBL19685091 | 0.85 | NUDT1 (0.39) | NUDT1BACE1HSP90AA1ACMSDTHRB | |
| SCHEMBL2868233 | 0.85 | HSP90AA1 (0.43) | NUDT1BACE1HSP90AA1ACMSDTHRB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 230 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240270891-A1 | PHENOLIC HYDROXY GROUP-CONTAINING RESIN, RESIN COMPOSITION FOR ALKALINE DEVELOPABLE RESIST, RESIST CURABLE RESIN COMPOSITION, AND METHOD FOR PRODUCING PHENOLIC HYDROXY GROUP-CONTAINING RESIN | DIC CORPORATION (JP) | 2024-08-15 | — | — | US | disclosed |
| CN-118325004-A | Phenolic hydroxyl group-containing resin, photosensitive resin composition, curable composition, and resist film | DIC株式会社 | 2024-07-12 | — | — | CN | disclosed |
| CN-114902135-B | Positive photosensitive resin composition, cured film, and resist film | DIC株式会社 | 2024-07-02 | — | — | CN | disclosed |
| CN-113348188-B | Phenolic hydroxyl group-containing resin, photosensitive composition, resist film, curable composition, and cured product | DIC株式会社 | 2024-05-10 | — | — | CN | disclosed |
| CN-117321109-A | Phenolic hydroxyl group-containing resin | DIC株式会社 | 2023-12-29 | — | — | CN | disclosed |
| CN-113227181-B | Resist composition | DIC株式会社 | 2023-07-18 | — | — | CN | disclosed |
| CN-116430671-A | Photoresist composition and photoetching process | 上海飞凯材料科技股份有限公司 | 2023-07-14 | — | — | CN | disclosed |
| CN-110959138-B | Resist material | DIC株式会社 | 2023-06-30 | — | — | CN | disclosed |
| CN-116360213-A | Resin composition and photoresist patterning method using the same | 深圳市容大感光科技股份有限公司 | 2023-06-30 | — | — | CN | disclosed |
| CN-116209690-A | Phenolic hydroxyl group-containing resin, resin composition for alkali-developable resist, resist-curable resin composition, and method for producing phenolic hydroxyl group-containing resin | DIC株式会社 | 2023-06-02 | — | — | CN | disclosed |
| US-5728504-A | Positive photoresist compositions and multilayer resist materials using the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 1998-03-17 | — | — | US | disclosed |
| US-5702861-A | BLEND OF ALKALI SOLUBLE RESIN, QUINONE DIAZIDE COMPOUND AND AN AROMATIC POLYHYDROXY COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 1997-12-30 | — | — | US | disclosed |
| US-5677102-A | DISSOLVING AN ALKALI SOLUBLE RESIN AND A QUINONEDIAZIDE GROUP CONTAINING COMPOUND; HEATING | TOKYO OHKA KOGYO CO., LTD. (JP) | 1997-10-14 | — | — | US | disclosed |
| US-5604077-A | MIXTURE OF ALKALI-SOLUBLE NOVOLAK AND A QUINONE DIAZIDE PHOTOSENSITIZER; HEAT RESISTANCE, RESOLUTION, ANTIFOULING AGENTS | TOKYO OHKA KOGYO CO., LTD. (JP) | 1997-02-18 | — | — | US | disclosed |
| US-5601961-A | QUINONE DIAZIDE GROUP-CONTAINING COMPOUND AS PHOTOSENSITIZING AGENT, ALKALI-SOLUBLE RESINOUS INGREDIENT AS FILM-FORMING AGENT MADE FROM A BLEND OF AT LEAST TWO NOVOLAK-TYPE RESINS FROM M-AND P-CRESOL, A XYLENOL AND A TRIMETHYLPHENOL | TOKYO OHKA KOGYO CO., LTD. (JP) | 1997-02-11 | — | — | US | disclosed |
| US-5576138-A | MIXTURE OF RESIN, PHOTOSENSITIZER AND BENZOPHENONE COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 1996-11-19 | — | — | US | disclosed |
| US-5501936-A | IMPROVED RESOLUTION OF VERY FINE PATTERNS | TOKYO OHKA KOGYO CO., LTD. (JP) | 1996-03-26 | — | — | US | disclosed |
| US-5478692-A | Fine patterning for electronics | TOKYO OHKA KOGYO CO., LTD. (JP) | 1995-12-26 | — | — | US | disclosed |
| US-5434031-A | Positive-working naphthoquinone diazide photoresist composition containing specific hydroxy compound additive | TOKYO OHKA KOGYO CO., LTD. (JP) | 1995-07-18 | — | — | US | disclosed |
| US-5401605-A | Positive working photosensitive resin composition containing 1,2-naphthoquinone diazide esterification product of triphenylmethane compound | TOKYO OHKA KOGYO CO., LTD. (JP) | 1995-03-28 | — | — | US | disclosed |