SCHEMBL2201799

SCHEMBL2201799

Oc1ccc(C(c2ccc(O)c(C3CCCCC3)c2)c2ccc(O)c(C3CCCCC3)c2)cc1O

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NUDT1 P36639 1/20 0.49
BACE1 P56817 1/20 0.49
HSP90AA1 P07900 1/20 0.49
HIF1A Q16665 3/20 0.45
HSD17B10 Q99714 3/20 0.45
ADRB2 P07550 4/20 0.40
ACMSD Q8TDX5 2/20 0.37
THRB P10828 2/20 0.37
TDP1 Q9NUW8 7/20 0.36
MAPT P10636 7/20 0.36
RECQL P46063 6/20 0.36
KDM4E B2RXH2 5/20 0.36
LMNA P02545 4/20 0.36
APEX1 P27695 3/20 0.36
BLM P54132 3/20 0.36
HPGD P15428 3/20 0.36
KMT2A Q03164 3/20 0.36
ADRB1 P08588 3/20 0.36
ADRB3 P13945 3/20 0.36
MEN1 O00255 2/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL761682 0.89 NUDT1 (0.48) NUDT1BACE1HSP90AA1HIF1AHSD17B10
SCHEMBL29375732 0.89 NUDT1 (0.48) NUDT1BACE1HSP90AA1HIF1AHSD17B10
SCHEMBL2861169 0.87 NUDT1 (0.47) NUDT1BACE1HSP90AA1HIF1AHSD17B10
SCHEMBL9136653 0.86 NUDT1 (0.46) NUDT1BACE1HSP90AA1HIF1AHSD17B10
SCHEMBL2858575 0.86 NUDT1 (0.46) NUDT1BACE1HSP90AA1HIF1AHSD17B10
SCHEMBL28462503 0.84 HIF1A (0.41) NUDT1BACE1HSP90AA1HIF1AHSD17B10
SCHEMBL29376176 0.84 NUDT1 (0.44) NUDT1BACE1HSP90AA1POLB
SCHEMBL27675462 0.84 NUDT1 (0.44) NUDT1BACE1HSP90AA1POLB
SCHEMBL30899189 0.84 NUDT1 (0.44) NUDT1BACE1HSP90AA1POLB
SCHEMBL761321 0.84 NUDT1 (0.44) NUDT1BACE1HSP90AA1POLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113785023-B Water-based ink composition for reversible thermochromic writing instrument, refill for refill and water-based ballpoint pen incorporating same 株式会社百乐 2023-05-12 CN disclosed
US-11640110-B2 Resin composition, method for producing heat-resistant resin film, and display device TORAY INDUSTRIES, INC. (JP) 2023-05-02 US disclosed
US-11333976-B2 Resin, photosensitive resin composition, electronic component and display device using the same TORAY INDUSTRIES, INC. (JP) 2022-05-17 US disclosed
US-20200192227-A1 RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM, AND DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2020-06-18 US disclosed
US-20170299965-A1 RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM, AND DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2017-10-19 US disclosed
EP-1630605-B1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2017-10-11 EP disclosed
EP-1496395-B1 Photosensitive resin precursor composition TORAY INDUSTRIES (JP) 2012-06-20 EP disclosed
US-20110193244-A1 ADHESIVE FILM AND PROCESS FOR PREPARING THE SAME AS WELL AS ADHESIVE SHEET AND SEMICONDUCTOR DEVICE MASUKO TAKASHI 2011-08-11 US disclosed
US-7977400-B2 polyimide, unsaturated polymerizable compound, photoinitiator; crosslinkable to form addition-condensation copolymer or polyetherimide copolymer; no imidation of polymer through high-temperature heat treatment; alkaline development; polyimide film having excellent heat resistance, strength, elongation TORAY INDUSTRIES, INC. (JP) 2011-07-12 US disclosed
US-20100167073-A1 ADHESIVE FILM AND SEMICONDUCTOR DEVICE USING SAME HITACHI CHEMICAL CO., LTD. (JP) 2010-07-01 US disclosed
US-6929890-B2 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2005-08-16 US disclosed
US-20050014876-A1 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2005-01-20 US disclosed
EP-1496395-A2 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2005-01-12 EP disclosed
EP-1475665-A1 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2004-11-10 EP disclosed
US-20040197703-A1 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2004-10-07 US disclosed
US-6733880-B2 HEAT RESISTANT THERMOPLASTIC RESIN, EPOXY RESIN AND TRIPHENOL CURING AGENT; RELIABLE LOW TEMPERATURES BONDING HITACHI CHEMICAL CO., LTD. (JP) 2004-05-11 US disclosed
US-20030062630-A1 Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same HITACHI CHEMICAL CO., LTD. (JP) 2003-04-03 US disclosed
US-6316170-B2 COATING, EXPOSURE, DEVELOPMENT AND HEAT TREATMENT KABUSHIKI KAISHA TOSHIBA (JP) 2001-11-13 US disclosed
US-6265129-B1 FORM A RESIST PATTERN THAT HAD A MICRO-GROOVE IN EACH ELEMENT AND WHICH YET WAS SATISFACTORY IN FEATURE PROFILE AND RESOLUTION. TOKYO OHKA KOGYO CO., LTD. (JP) 2001-07-24 US disclosed
US-20010006767-A1 Developing solution and method of forming polyimide pattern by using the developing solution YOSHIAKI KAWAMONZEN 2001-07-05 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11333976-B2 Resin, photosensitive resin composition, electronic component and display device using the same EED, RPL19, RARA NUDT1 3347/4885BACE1 4538/4885HSP90AA1 52/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.