SCHEMBL29397015

SCHEMBL29397015

O=C(NC(Cc1ccccc1)C(=O)Oc1ccc2ccccc2c1)c1ccccc1

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CTSL P07711 5/20 0.58
GAA P10253 1/20 0.57
RAB9A P51151 1/20 0.57
ACE P12821 3/20 0.55
PTPN1 P18031 3/20 0.53
PPARG P37231 1/20 0.51
PPARA Q07869 1/20 0.51
GPR132 Q9UNW8 1/20 0.51
PTPN2 P17706 1/20 0.51
CDC25B P30305 1/20 0.51
ALDH1A1 P00352 1/20 0.50
LMNA P02545 1/20 0.50
GLA P06280 1/20 0.50
CA2 P00918 1/20 0.50
MEN1 O00255 1/20 0.50
MAPT P10636 1/20 0.50
KMT2A Q03164 1/20 0.50
TDP1 Q9NUW8 1/20 0.50
PIN1 Q13526 1/20 0.49
CTSS P25774 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4953990 1.00 CTSL (0.58) CTSLGAARAB9AACEPTPN1
SCHEMBL11329819 1.00 CTSL (0.58) CTSLGAARAB9AACEPTPN1
SCHEMBL1569237 0.86 TACR1 (0.61) GAARAB9APPARGPPARAALDH1A1
SCHEMBL4260431 0.86 TACR1 (0.61) GAARAB9APPARGPPARAALDH1A1
SCHEMBL29638875 0.86 TACR1 (0.61) GAARAB9APPARGPPARAALDH1A1
SCHEMBL11418968 0.81 CTSS (0.60) CTSLACEPTPN1PPARGPPARA
SCHEMBL29519974 0.79 CTSL (0.57) CTSLGAARAB9AACEGPR132
SCHEMBL31206887 0.78 GAA (0.76) CTSLGAARAB9AACEALDH1A1
SCHEMBL1793176 0.78 GAA (0.76) CTSLGAARAB9AACEALDH1A1
SCHEMBL2461492 0.78 GAA (0.76) CTSLGAARAB9AACEALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118421244-B Solvent-free high-temperature-resistant epoxy adhesive for prepreg, and preparation method and application thereof 株洲和诚科技有限责任公司 2024-09-20 CN disclosed
CN-110194941-B Dimensionally stable latent type heatable and curable epoxy adhesive film and preparation method thereof 厦门艾贝森电子有限公司 2024-09-17 CN disclosed
CN-118421244-A Solvent-free high-temperature-resistant epoxy adhesive for prepreg, and preparation method and application thereof 株洲和诚科技有限责任公司 2024-08-02 CN disclosed
CN-111484806-B Epoxy thermosetting adhesive film with initial adhesiveness and preparation method and application thereof 顺德职业技术学院 2022-03-08 CN disclosed