SCHEMBL29397402

SCHEMBL29397402

N#COc1cccc2c(OC#N)cccc12

nearest known ligand 0.38

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
IMPDH2 P12268 1/20 0.38
IMPDH1 P20839 1/20 0.38
ALDH1A1 P00352 2/20 0.31
GAA P10253 2/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
KDM4E B2RXH2 1/20 0.31
MEN1 O00255 1/20 0.31
MAPT P10636 1/20 0.31
CACNA1B Q00975 1/20 0.31
APBA1 Q02410 1/20 0.31
KMT2A Q03164 1/20 0.31
CA1 P00915 1/20 0.30
CA2 P00918 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3423696 1.00 IMPDH2 (0.38) IMPDH2IMPDH1ALDH1A1GAASMN1; SMN2
SCHEMBL29364244 0.90 IMPDH2 (0.47) IMPDH2IMPDH1ALDH1A1GAASMN1; SMN2
SCHEMBL184490 0.90 IMPDH2 (0.47) IMPDH2IMPDH1ALDH1A1GAASMN1; SMN2
SCHEMBL11710251 0.87 ESR1 (0.46) ALDH1A1GAASMN1; SMN2KDM4EMEN1
SCHEMBL30725930 0.86 HTR1B (0.46) ALDH1A1GAAKDM4EMEN1KMT2A
SCHEMBL822708 0.86 HTR1B (0.46) ALDH1A1GAAKDM4EMEN1KMT2A
Hydrogen Sulfide SCHEMBL28001728 0.84 HTR1B (0.44) ALDH1A1GAAKDM4EMEN1KMT2A
SCHEMBL159732 0.80 CA1 (0.38) IMPDH2IMPDH1ALDH1A1GAACA1
SCHEMBL30159634 0.80 CA1 (0.38) IMPDH2IMPDH1ALDH1A1GAACA1
SCHEMBL17042693 0.80 IMPDH2 (0.63) IMPDH2IMPDH1ALDH1A1SMN1; SMN2KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117355545-B Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2024-10-18 CN disclosed
CN-116157915-B Thermosetting resin composition and semiconductor device 信越化学工业株式会社 2024-09-24 CN disclosed
CN-118043384-A Prepreg, laminate and printed circuit board 三菱瓦斯化学株式会社 2024-05-14 CN disclosed
CN-117500850-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2024-02-02 CN disclosed
CN-117500851-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2024-02-02 CN disclosed
CN-117355545-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2024-01-05 CN disclosed
CN-117222682-A Cured resin composition and cured product thereof 日本化药株式会社 2023-12-12 CN disclosed
CN-109721948-B Semiconductor encapsulation resin composition and semiconductor device 信越化学工业株式会社 2023-09-22 CN disclosed
CN-114106511-A Power module manufacturing method and power module 信越化学工业株式会社 2022-03-01 CN disclosed