SCHEMBL184490

SCHEMBL184490

N#COc1ccc(OC#N)c2ccccc12

nearest known ligand 0.47

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
IMPDH2 P12268 2/20 0.47
IMPDH1 P20839 2/20 0.47
IDO1 P14902 2/20 0.37
KDM4E B2RXH2 3/20 0.36
ALDH1A1 P00352 3/20 0.36
MAPT P10636 2/20 0.36
MEN1 O00255 1/20 0.36
GAA P10253 1/20 0.36
CACNA1B Q00975 1/20 0.36
APBA1 Q02410 1/20 0.36
KMT2A Q03164 1/20 0.36
EP300 Q09472 1/20 0.35
KAT8 Q9H7Z6 1/20 0.35
TSHR P16473 1/20 0.32
MAPK1 P28482 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
CA1 P00915 1/20 0.30
CA2 P00918 1/20 0.30
NQO1 P15559 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29364244 1.00 IMPDH2 (0.47) IMPDH2IMPDH1IDO1KDM4EALDH1A1
SCHEMBL3423696 0.90 IMPDH2 (0.38) IMPDH2IMPDH1KDM4EALDH1A1MAPT
SCHEMBL29397402 0.90 IMPDH2 (0.38) IMPDH2IMPDH1KDM4EALDH1A1MAPT
SCHEMBL17042693 0.89 IMPDH2 (0.63) IMPDH2IMPDH1IDO1KDM4EALDH1A1
SCHEMBL29664146 0.89 IMPDH2 (0.63) IMPDH2IMPDH1IDO1KDM4EALDH1A1
SCHEMBL11707895 0.87 IDO1 (0.52) IMPDH2IMPDH1IDO1KDM4EALDH1A1
SCHEMBL822708 0.81 HTR1B (0.46) KDM4EALDH1A1MEN1GAAKMT2A
SCHEMBL30725930 0.81 HTR1B (0.46) KDM4EALDH1A1MEN1GAAKMT2A
SCHEMBL30159634 0.80 CA1 (0.38) IMPDH2IMPDH1ALDH1A1GAATSHR
SCHEMBL159732 0.80 CA1 (0.38) IMPDH2IMPDH1ALDH1A1GAATSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 287 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6790473-B2 EPOXY RESIN INTERNATIONAL BUSINESS MACHINES CORPORATION 2004-09-14 US claimed
US-6770691-B2 (A) BROMINE-FREE EPOXY RESIN AND CURING AGENT; (B) A FLAME RETARDANT ADDITIVE THAT IS THE CONDENSATION PRODUCT OF A BROMINATED PHENOL AND A CYANURIC HALIDE; (C) THERMOPLASTIC RESIN (POLYPHENYLENE ETHER), AND (D) A CYANATE ESTER GENERAL ELECTRIC COMPANY 2004-08-03 US claimed
US-20020107308-A1 Curable epoxy resin compositions and the cured residues thereof CITIBANK, N.A., AS COLLATERAL AGENT 2002-08-08 US claimed
US-12606723-B2 Thermosetting resin composition, semiconductor device and electrical/electronic component KYOCERA CORPORATION (JP) 2026-04-21 US disclosed
US-12583966-B2 Curable resin, cured product thereof, resin composition, and method for producing curable resin MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2026-03-24 US disclosed
US-12565608-B2 Thermally conductive resin composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-03-03 US disclosed
US-12544830-B2 Method for producing silver particles, thermosetting resin composition, semiconductor device, and electrical and/or electronic components KYOCERA CORPORATION (JP) 2026-02-10 US disclosed
US-12539539-B2 Silver particles, method for producing silver particles, paste composition, semiconductor device, and electrical and/or electronic components KYOCERA CORPORATION (JP) 2026-02-03 US disclosed
EP-4635650-A1 PASTE COMPOSITION, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME, AND ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME KYOCERA Corporation (JP) 2025-10-22 EP disclosed
EP-3733746-B1 RESIN COMPOSITION, PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD MITSUBISHI GAS CHEMICAL CO (JP) 2025-08-27 EP disclosed
US-20250254792-A1 RESIN COMPOSITION, PREPREG, RESIN SHEET, LAMINATE, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-08-07 US disclosed
EP-1951814-A1 POLY(ARYLENE ETHER) COMPOSITION, METHOD, AND ARTICLE General Electric Company (US) 2008-08-06 EP disclosed
EP-1940936-A1 POLYMER COMPOSITION, METHOD, AND ARTICLE General Electric Company (US) 2008-07-09 EP disclosed
WO-2008036454-A1 POLY (ARYLENE ETHER) COPOLYMER SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2008-03-27 WO disclosed
WO-2007044312-A1 POLY(ARYLENE ETHER) COMPOSITION, METHOD, AND ARTICLE GENERAL ELECTRIC COMPANY (US) 2007-04-19 WO disclosed
WO-2007044294-A1 POLYMER COMPOSITION, METHOD, AND ARTICLE GENERAL ELECTRIC COMPANY (US) 2007-04-19 WO disclosed
WO-2007044489-A1 FLAME RETARDANT COMPOSITION AND METHOD GENERAL ELECTRIC COMPANY (US) 2007-04-19 WO disclosed
US-20070080330-A1 Flame retardant composition and method CITIBANK, N.A., AS COLLATERAL AGENT 2007-04-12 US disclosed
US-20070082986-A1 Polymer composition, method, and article SABIC GLOBAL TECHNOLOGIES IP B.V. (NL) 2007-04-12 US disclosed
US-20070082987-A1 Poly(arylene ether) composition, method, and article SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2007-04-12 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12565608-B2 Thermally conductive resin composition ITGAM, RAE1, FCGR1A IMPDH2 3829/4885IMPDH1 3753/4885IDO1 3692/4885
US-12539539-B2 Silver particles, method for producing silver particles, paste composition, semiconductor device, and electrical and/or electronic components DNMT3A, RPA1, BET1 IMPDH2 4499/4885IMPDH1 3993/4885IDO1 2535/4885
US-12583966-B2 Curable resin, cured product thereof, resin composition, and method for producing curable resin ARL1, ASH2L, SEM1 IMPDH2 4409/4885IMPDH1 4098/4885IDO1 3809/4885
US-12606723-B2 Thermosetting resin composition, semiconductor device and electrical/electronic component RPS3A, SEM1, DAP3 IMPDH2 4826/4885IMPDH1 4732/4885IDO1 4664/4885
US-12544830-B2 Method for producing silver particles, thermosetting resin composition, semiconductor device, and electrical and/or electronic components RPL37A, RPL39, RPL36A IMPDH2 4877/4885IMPDH1 4873/4885IDO1 4826/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.