SCHEMBL30159634

SCHEMBL30159634

N#COc1ccccc1OC#N

nearest known ligand 0.38

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
CA1 P00915 3/20 0.38
CA2 P00918 3/20 0.38
CA7 P43166 2/20 0.38
CA9 Q16790 2/20 0.38
CA12 O43570 1/20 0.38
CA4 P22748 1/20 0.38
CA14 Q9ULX7 1/20 0.38
TSHR P16473 3/20 0.36
POLB P06746 1/20 0.34
GAA P10253 1/20 0.34
IMPDH2 P12268 1/20 0.32
IMPDH1 P20839 1/20 0.32
TP53 P04637 1/20 0.31
ALDH1A1 P00352 1/20 0.31
ADRA2B P18089 1/20 0.31
PTGS1 P23219 1/20 0.31
TDP1 Q9NUW8 1/20 0.31
CYP2A6 P11509 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL159732 1.00 CA1 (0.38) CA1CA2CA7CA9CA12
Ethylene SCHEMBL27752633 0.94 CA12 (0.35) CA1CA2CA7CA9CA12
SCHEMBL1324603 0.92 AR (0.38) CA1CA2CA7CA9CA12
SCHEMBL2405150 0.87 CA1 (0.62) CA1CA2CA7CA9CA12
SCHEMBL28795709 0.87 CA12 (0.31) CA1CA2CA7CA9CA12
SCHEMBL1305477 0.86 PIM1 (0.34) CA1CA2CA7CA9CA12
SCHEMBL1324477 0.85
SCHEMBL3994528 0.85 ALDH1A1 (0.52) TSHRPOLBGAAALDH1A1
SCHEMBL4596663 0.83 TSHR (0.46) TSHRPOLBGAAALDH1A1
SCHEMBL8848905 0.82 LMNA (0.40) ALDH1A1ADRA2B

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12595334-B2 Compound, mixture, curable resin composition and cured product thereof, and method for producing compound NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2026-04-07 US disclosed
CN-119866352-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 日本化药株式会社 2025-04-22 CN disclosed
CN-115003716-B Resin composition, resin sheet, prepreg, and printed wiring board 三菱瓦斯化学株式会社 2025-04-11 CN disclosed
CN-117529509-B Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2025-01-10 CN disclosed
CN-117355545-B Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2024-10-18 CN disclosed
US-20240262941-A1 MALEIMIDE RESIN, AMINE RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2024-08-08 US disclosed
CN-115175951-B Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board 三菱瓦斯化学株式会社 2024-07-12 CN disclosed
CN-118043384-A Prepreg, laminate and printed circuit board 三菱瓦斯化学株式会社 2024-05-14 CN disclosed
CN-117529509-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2024-02-06 CN disclosed
CN-117500850-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2024-02-02 CN disclosed
CN-117500851-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2024-02-02 CN disclosed
CN-117355545-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2024-01-05 CN disclosed
CN-117222682-A Cured resin composition and cured product thereof 日本化药株式会社 2023-12-12 CN disclosed
CN-116888189-A Thermosetting resin composition, cured product, resin sheet, prepreg, metal foil-clad laminate, multilayer printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device 日本化药株式会社 2023-10-13 CN disclosed
US-20230002547-A1 COMPOUND, MIXTURE, CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, AND METHOD FOR PRODUCING COMPOUND NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2023-01-05 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12595334-B2 Compound, mixture, curable resin composition and cured product thereof, and method for producing compound RER1, RXRA, TERB1 CA1 2113/4885CA2 3730/4885CA7 2432/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.