SCHEMBL29414076

SCHEMBL29414076

COc1ccccc1C1N(C)c2ccccc2N1C

nearest known ligand 0.69

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ LMNA P02545 1/20 0.69
▸ DRD2 P14416 2/20 0.44
▸ CA12 O43570 1/20 0.44
▸ CA1 P00915 1/20 0.44
▸ CA2 P00918 1/20 0.44
▸ CA4 P22748 1/20 0.44
▸ CA7 P43166 1/20 0.44
▸ CA9 Q16790 1/20 0.44
▸ CA14 Q9ULX7 1/20 0.44
▸ DRD3 P35462 1/20 0.44
▸ HSD11B1 P28845 2/20 0.43
▸ HTR2C P28335 2/20 0.43
▸ SLC6A2 P23975 1/20 0.43
▸ SLC6A4 P31645 1/20 0.43
▸ SLC6A3 Q01959 1/20 0.43
▸ MEN1 O00255 1/20 0.42
▸ USP2 O75604 1/20 0.42
▸ KMT2A Q03164 1/20 0.42
▸ MGLL Q99685 1/20 0.42
▸ ALDH1A1 P00352 2/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12978570 1.00 LMNA (0.69) LMNADRD2CA12CA1CA2
SCHEMBL21972264 0.82 LMNA (0.53) LMNADRD2CA12CA1CA2
SCHEMBL21970999 0.82 LMNA (0.56) LMNADRD2DRD3SLC6A2SLC6A4
SCHEMBL21970634 0.81 LMNA (0.59) LMNADRD2CA12CA1CA2
SCHEMBL28267908 0.80 LMNA (0.50) LMNADRD2DRD3HTR2CMEN1
SCHEMBL21971403 0.77 LMNA (0.63) LMNAMEN1KMT2AALDH1A1KDM4E
SCHEMBL21971009 0.77 LMNA (0.63) LMNAMEN1KMT2AALDH1A1KDM4E
SCHEMBL4009783 0.77 DRD2 (0.51) DRD2CA12CA1CA2CA4
SCHEMBL21972245 0.75 LMNA (0.53) LMNADRD2CA12CA1CA2
SCHEMBL21971404 0.73 LMNA (0.58) LMNADRD2CA12CA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250067603-A1 THERMOELECTRIC CONVERSION ELEMENT AND SENSOR MODULE NITTO DENKO CORPORATION (JP) 2025-02-27 — — US disclosed
WO-2023127591-A1 SENSOR-EQUIPPED VACUUM HEAT INSULATION MATERIAL 日東電工株式会社 2023-07-06 — — WO disclosed
CN-114394587-A Graphene PN junction semiconductor refrigerating sheet and preparation method thereof 广东墨睿科技有限公司 2022-04-26 — — CN disclosed
CN-114096638-A Stable inks comprising semiconductor particles and uses thereof 奈科斯多特股份公司 2022-02-25 — — CN disclosed
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