SCHEMBL29417865

SCHEMBL29417865

O=C(CCCCCCCCCCC(=O)NNC(=O)c1ccccc1O)NNC(=O)c1ccccc1O

nearest known ligand 0.62

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
L3MBTL1 Q9Y468 1/20 0.59
CA1 P00915 2/20 0.57
CA9 Q16790 2/20 0.57
L1CAM P32004 1/20 0.54
RAB9A P51151 4/20 0.53
SMN1; SMN2 Q16637 3/20 0.53
ALDH1A1 P00352 2/20 0.53
MITF O75030 1/20 0.53
POLB P06746 1/20 0.53
NPC1 O15118 3/20 0.53
KDM4E B2RXH2 3/20 0.53
CYP2D6 P10635 1/20 0.53
CYP2C9 P11712 1/20 0.53
HTT P42858 1/20 0.53
MPO P05164 1/20 0.52
GAA P10253 1/20 0.52
HIF1A Q16665 1/20 0.52
NAAA Q02083 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1169074 1.00 L3MBTL1 (0.59) L3MBTL1CA1CA9L1CAMRAB9A
SCHEMBL30912997 0.98 L3MBTL1 (0.61) L3MBTL1CA1CA9L1CAMRAB9A
SCHEMBL13593272 0.94 L3MBTL1 (0.54) L3MBTL1CA1CA9L1CAMRAB9A
SCHEMBL6633461 0.92 NAAA (0.62) L3MBTL1CA1CA9POLBGAA
SCHEMBL13990402 0.92 NAAA (0.62) L3MBTL1CA1CA9POLBGAA
SCHEMBL11315978 0.92 NAAA (0.62) L3MBTL1CA1CA9POLBGAA
SCHEMBL13593267 0.89 L3MBTL1 (0.56) L3MBTL1CA1CA9L1CAMRAB9A
SCHEMBL30992859 0.85 L3MBTL1 (0.47) L3MBTL1CA1CA9L1CAMRAB9A
SCHEMBL6635022 0.85 CA1 (0.59) L3MBTL1CA1CA9L1CAMRAB9A
SCHEMBL13593268 0.85 L3MBTL1 (0.62) L3MBTL1CA1CA9L1CAMRAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 78 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122080895-A Polyglycolic acid composition and preparation method thereof, biodegradable polyester material and application thereof, and PGA temporary plugging ball and preparation method thereof 2026-05-26 CN claimed
US-20250109256-A1 SILICONE RUBBER COMPOSITION DOW SILICONES CORP (US) 2025-04-03 US claimed
US-20250019497-A1 THERMALLY CONDUCTIVE SILICONE RUBBER COMPOSITION DOW SILICONES CORP (US) 2025-01-16 US claimed
CN-119307071-A Halogen-free flame-retardant reinforced PBT (polybutylene terephthalate) composition and preparation method and application thereof 金发科技股份有限公司 2025-01-14 CN claimed
US-20240279468-A1 CURABLE SILICONE RUBBER COMPOSITIONS DOW SILICONES CORP (US) 2024-08-22 US claimed
CN-115975367-B Polycarbonate composition with good processing stability, and preparation method and application thereof 金发科技股份有限公司 2024-05-14 CN claimed
CN-117362970-A Polycarbonate composition and preparation method and application thereof 金发科技股份有限公司 2024-01-09 CN claimed
CN-117043282-A Compositions and methods for improving durability of electrically insulating and water repellent gel coat systems 雅客纳米公司 2023-11-10 CN claimed
CN-115975367-A Polycarbonate composition with good processing stability and preparation method and application thereof 金发科技股份有限公司 2023-04-18 CN claimed
CN-122080895-A Polyglycolic acid composition and preparation method thereof, biodegradable polyester material and application thereof, and PGA temporary plugging ball and preparation method thereof 2026-05-26 CN disclosed
CN-119730985-B Soldering flux and method for producing bonded body 千住金属工业株式会社 2026-02-27 CN disclosed
US-20250353966-A1 LIQUID SILICONE RUBBER COMPOSITION DOW SILICONES CORP (US) 2025-11-20 US disclosed
EP-4626665-A1 SILICONE MANUFACTURING Dow Silicones Corporation (US) 2025-10-08 EP disclosed
EP-4594408-A1 LIQUID SILICONE RUBBER COMPOSITION Dow Silicones Corporation (US) 2025-08-06 EP disclosed
CN-114378475-A Solder paste 千住金属工业株式会社 2022-04-22 CN disclosed
CN-114378482-A Flux and solder paste 千住金属工业株式会社 2022-04-22 CN disclosed
CN-114364738-A Insulating resin composition, insulating resin cured product, laminate, and circuit board 电化株式会社 2022-04-15 CN disclosed
CN-114341263-A Insulating resin composition, insulating resin cured product, laminate, and circuit board 电化株式会社 2022-04-12 CN disclosed
CN-114155995-A Insulated wire and cable 日立金属株式会社 2022-03-08 CN disclosed
CN-114149643-A Cable and insulated wire 日立金属株式会社 2022-03-08 CN disclosed