SCHEMBL29429119

SCHEMBL29429119

Cc1cc(-c2cc(C)c(O)c(C)c2C)c(C)c(C)c1O

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA1 P00915 1/20 0.48
CA2 P00918 1/20 0.48
MAPT P10636 5/20 0.39
KDM4E B2RXH2 4/20 0.39
ALDH1A1 P00352 4/20 0.39
GAA P10253 3/20 0.39
LMNA P02545 2/20 0.39
CYP1A2 P05177 3/20 0.38
CYP2C9 P11712 3/20 0.38
CYP2C19 P33261 2/20 0.38
MAPK1 P28482 2/20 0.38
NPSR1 Q6W5P4 2/20 0.38
CYP3A4 P08684 2/20 0.38
CYP2D6 P10635 2/20 0.38
G6PD P11413 2/20 0.38
PKM P14618 2/20 0.38
HPGD P15428 2/20 0.38
ALOX15 P16050 1/20 0.38
ALOX12 P18054 1/20 0.38
CCR6 P51684 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1176388 1.00 CA1 (0.48) CA1CA2MAPTKDM4EALDH1A1
SCHEMBL18948599 0.88 LMNA (0.43) CA1CA2MAPTKDM4EALDH1A1
SCHEMBL16424027 0.86 ALDH1A1 (0.61) CA1CA2MAPTKDM4EALDH1A1
SCHEMBL3752346 0.85 CA1 (0.59) CA1CA2MAPTKDM4EALDH1A1
SCHEMBL17060497 0.85 CA1 (0.46) CA1CA2MAPTKDM4EALDH1A1
SCHEMBL7522981 0.84 CA1 (0.36) CA1CA2MAPTKDM4EALDH1A1
SCHEMBL8377221 0.84 ALDH1A1 (0.41) MAPTKDM4EALDH1A1GAALMNA
Phenol SCHEMBL4666810 0.84 TDP1 (0.46) CA1CA2MAPTALDH1A1GAA
SCHEMBL31545136 0.82 ESR1 (0.41) CA1CA2MAPTKDM4EALDH1A1
SCHEMBL1224695 0.82 CA1 (0.48) CA1CA2MAPTKDM4EALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3686234-B1 METHOD FOR PREPARING A POLY(PHENYLENE ETHER) AND POLY(PHENYLENE ETHER) PREPARED THEREBY SHPP GLOBAL TECH BV (NL) 2024-09-04 EP claimed
EP-4563610-A1 RESIN COMPOSITION CONTAINING BIFUNCTIONAL PHENYLENE ETHER RESIN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-06-04 EP disclosed
US-20250043079-A1 POLYIMIDE, POLYIMIDE VARNISH, AND POLYIMIDE THIN FILM TOKYO INSTITUTE OF TECHNOLOGY (JP) 2025-02-06 US disclosed
US-20240360310-A1 RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE NAMICS CORPORATION (JP) 2024-10-31 US disclosed
WO-2024024730-A1 RESIN COMPOSITION CONTAINING BIFUNCTIONAL PHENYLENE ETHER RESIN 三菱瓦斯化学株式会社 2024-02-01 WO disclosed
WO-2023190280-A1 POLYETHER NITRILE MOLDING MATERIAL, METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING POLYETHER NITRILE RESIN COMPOSITION MOLDING MATERIAL 本州化学工業株式会社 2023-10-05 WO disclosed
WO-2023189822-A1 METHOD FOR MANUFACTURING POLYETHER NITRILE MOLDING MATERIAL AND METHOD FOR MANUFACTURING POLYETHER NITRILE RESIN COMPOSITION MOLDING MATERIAL 本州化学工業株式会社 2023-10-05 WO disclosed
WO-2023090096-A1 POLYETHER NITRILE MOLDING MATERIAL, METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUACTURING POLYETHER NITRILE RESIN COMPOSITION MOLDING MATERIAL 本州化学工業株式会社 2023-05-25 WO disclosed
CN-115917433-A Photosensitive resin composition, cured product thereof, and wiring structure containing cured product thereof 纳美仕有限公司 2023-04-04 CN disclosed
WO-2023027031-A1 POLYIMIDE, POLYIMIDE VARNISH, AND POLYIMIDE THIN FILM 国立大学法人東京工業大学 2023-03-02 WO disclosed
WO-2022176821-A1 POWDER OF 2,2',3,3',5,5'-HEXAMETHYLBIPHENYL-4,4'-DIOL BIS(TRIMELLITATE ANHYDRIDE) 本州化学工業株式会社 2022-08-25 WO disclosed
WO-2022176821-A1 POWDER OF 2,2',3,3',5,5'-HEXAMETHYLBIPHENYL-4,4'-DIOL BIS(TRIMELLITATE ANHYDRIDE) 本州化学工業株式会社 2022-08-25 WO disclosed
WO-2022065329-A1 THERMOPLASTIC RESIN, COMPOSITION, MOLDED ARTICLE, OPTICAL LENS, AND METHOD FOR PRODUCING THERMOPLASTIC RESIN 三菱瓦斯化学株式会社 2022-03-31 WO disclosed