Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.64 |
| ▸ | FFAR1 | O14842 | 1/20 | 0.39 |
| ▸ | CPT2 | P23786 | 1/20 | 0.39 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.39 |
| ▸ | FDPS | P14324 | 8/20 | 0.35 |
| ▸ | GGPS1 | O95749 | 5/20 | 0.35 |
| ▸ | ACLY | P53396 | 1/20 | 0.33 |
| ▸ | ACACB | O00763 | 1/20 | 0.32 |
| ▸ | ACACA | Q13085 | 1/20 | 0.32 |
| ▸ | SMPD1 | P17405 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3040312 | 1.00 | ALDH1A1 (0.64) | ALDH1A1FFAR1CPT2TDP1FDPS | |
| SCHEMBL2945318 | 1.00 | ALDH1A1 (0.64) | ALDH1A1FFAR1CPT2TDP1FDPS | |
| SCHEMBL5915749 | 1.00 | ALDH1A1 (0.64) | ALDH1A1FFAR1CPT2TDP1FDPS | |
| SCHEMBL1269985 | 0.96 | ALDH1A1 (0.69) | ALDH1A1FFAR1CPT2TDP1FDPS | |
| SCHEMBL8898379 | 0.90 | ALDH1A1 (0.53) | ALDH1A1FFAR1CPT2TDP1FDPS | |
| SCHEMBL17523914 | 0.90 | ALDH1A1 (0.53) | ALDH1A1FFAR1CPT2TDP1FDPS | |
| SCHEMBL2818804 | 0.88 | ALDH1A1 (0.69) | ALDH1A1 | |
| SCHEMBL23877897 | 0.87 | ALDH1A1 (0.50) | ALDH1A1FFAR1CPT2TDP1FDPS | |
| SCHEMBL2188894 | 0.87 | FDPS (0.50) | ALDH1A1FDPSGGPS1SMPD1 | |
| SCHEMBL21410066 | 0.87 | ALDH1A1 (0.50) | ALDH1A1FFAR1CPT2TDP1FDPS |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7736834-B2 | Photosensitive resin composition, photosensitive element employing it, resist pattern forming method, process for manufacturing printed circuit board and method for removing photocured product | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2010-06-15 | — | — | US | disclosed |
| CN-1842742-B | Photosensitive resin composition, photosensitive element using same, method for forming resist pattern, method for producing printed wiring board, and method for removing photocured product | HITACHI CHEMICAL CO LTD | 2010-05-12 | — | — | CN | disclosed |
| US-20070111136-A1 | Photosensitive resin composition, photosensitive element employing it, resist pattern forming method, process for manufacturing printed circuit board and method for removing photocured product | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2007-05-17 | — | — | US | disclosed |
| CN-1842742-A | Photosensitive resin composition, photosensitive element using same, method for forming resist pattern, method for producing printed wiring board, and method for removing photocured product | HITACHI CHEMICAL CO LTD (JP) | 2006-10-04 | — | — | CN | disclosed |
| US-20060068324-A1 | Positive photosensitive resin and novel dithiol compound | MARUZEN PETROCHEMICAL CO., LTD. (JP) | 2006-03-30 | — | — | US | disclosed |
| US-6355702-B1 | HEAT DECOMPOSITION OF ACRYLIC RESIN; CURING; CROSSLINKED NETWORK | CORNELL RESEARCH FOUNDATION, INC. | 2002-03-12 | — | — | US | disclosed |