SCHEMBL29433017

SCHEMBL29433017

CN(C)c1ccc(/C=C/c2nc3ccccc3s2)cc1

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ MEN1 O00255 7/20 1.00
▸ KMT2A Q03164 7/20 1.00
▸ MAPT P10636 6/20 1.00
▸ RAB9A P51151 5/20 1.00
▸ SMN1; SMN2 Q16637 3/20 1.00
▸ APP P05067 3/20 1.00
▸ INSR P06213 2/20 1.00
▸ NCOA1 Q15788 1/20 1.00
▸ NPC1 O15118 2/20 0.73
▸ CYP1A2 P05177 1/20 0.73
▸ CYP3A4 P08684 1/20 0.73
▸ CYP2D6 P10635 1/20 0.73
▸ CYP2C19 P33261 1/20 0.73
▸ NPSR1 Q6W5P4 1/20 0.73
▸ KAT8 Q9H7Z6 1/20 0.58
▸ L3MBTL1 Q9Y468 3/20 0.56
▸ LMNA P02545 2/20 0.56
▸ ATP4A P20648 8/20 0.55
▸ ATP4B P51164 8/20 0.55
▸ TDP1 Q9NUW8 2/20 0.55

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29413750 1.00 MEN1 (1.00) MEN1KMT2AMAPTRAB9ASMN1; SMN2
SCHEMBL476578 1.00 MEN1 (1.00) MEN1KMT2AMAPTRAB9ASMN1; SMN2
SCHEMBL476579 1.00 MEN1 (1.00) MEN1KMT2AMAPTRAB9ASMN1; SMN2
Iodide SCHEMBL8390905 0.99 MEN1 (0.97) MEN1KMT2AMAPTRAB9ASMN1; SMN2
Iodide SCHEMBL8390903 0.99 MEN1 (0.97) MEN1KMT2AMAPTRAB9ASMN1; SMN2
Bromide SCHEMBL8389954 0.99 MEN1 (0.97) MEN1KMT2AMAPTRAB9ASMN1; SMN2
Bromide SCHEMBL8389953 0.99 MEN1 (0.97) MEN1KMT2AMAPTRAB9ASMN1; SMN2
SCHEMBL9841114 0.92 MEN1 (0.84) MEN1KMT2AMAPTRAB9ASMN1; SMN2
SCHEMBL31447671 0.92 MEN1 (0.84) MEN1KMT2AMAPTRAB9ASMN1; SMN2
SCHEMBL29409733 0.92 MEN1 (0.84) MEN1KMT2AMAPTRAB9ASMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 114 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120153318-A Photosensitive resin composition, method for producing cured relief pattern using same, and method for producing polyimide film 旭化成株式会社 2025-06-13 — — CN disclosed
CN-120129875-A Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2025-06-10 — — CN disclosed
CN-120129876-A Negative photosensitive resin composition, method for producing polyimide cured film using same, and polyimide cured film 旭化成株式会社 2025-06-10 — — CN disclosed
CN-120077104-A Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device 富士胶片株式会社 2025-05-30 — — CN disclosed
CN-116648313-B Resin composition, cured product, laminate, method for producing cured product, and semiconductor device 富士胶片株式会社 2025-05-16 — — CN disclosed
CN-119998728-A Film manufacturing method, photosensitive resin composition, cured product manufacturing method, cured product, and laminate 富士胶片株式会社 2025-05-13 — — CN disclosed
CN-119968421-A Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device 富士胶片株式会社 2025-05-09 — — CN disclosed
CN-119937247-A Curable resin composition, resin film, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2025-05-06 — — CN disclosed
CN-119866360-A Polymer composition and single layer phase difference material 日产化学株式会社 2025-04-22 — — CN disclosed
CN-119856108-A Liquid crystal aligning agent and liquid crystal display element 日产化学株式会社 2025-04-18 — — CN disclosed
CN-109153857-B Polarizing layer forming composition 日产化学株式会社 2022-04-26 — — CN disclosed
CN-109154685-B Alignment layer forming composition 日产化学株式会社 2022-04-19 — — CN disclosed
WO-2022064917-A1 CURED PRODUCT PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD 富士フイルム株式会社 2022-03-31 — — WO disclosed
CN-114249912-A Method for producing polyimide cured film 旭化成株式会社 2022-03-29 — — CN disclosed
CN-114253076-A Photosensitive resin composition 旭化成株式会社 2022-03-29 — — CN disclosed
CN-114207522-A Negative photosensitive resin composition, method for producing polyimide, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2022-03-18 — — CN disclosed
CN-114174907-A Transverse electric field liquid crystal display element and method for manufacturing transverse electric field liquid crystal cell 日产化学株式会社 2022-03-11 — — CN disclosed
CN-109476926-B Polymer composition 日产化学株式会社 2022-03-04 — — CN disclosed
CN-108475023-B Photosensitive resin composition, dry film, cured product and printed wiring board 太阳控股株式会社 2022-02-25 — — CN disclosed
CN-114008526-A Curable resin composition, method for producing curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2022-02-01 — — CN disclosed
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