SCHEMBL2943483

SCHEMBL2943483

Cc1c[nH]c(Cc2cccc3ccccc23)n1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ADRA2A P08913 4/20 0.55
ADRA2B P18089 4/20 0.55
ADRA2C P18825 4/20 0.55
ADRA1A P35348 3/20 0.53
ADRA1D P25100 2/20 0.53
ADRA1B P35368 2/20 0.53
ALDH1A1 P00352 3/20 0.44
MAPK1 P28482 3/20 0.44
LMNA P02545 2/20 0.44
TAAR1 Q96RJ0 2/20 0.44
CYP2D6 P10635 2/20 0.44
HTR1A P08908 1/20 0.44
MAPT P10636 1/20 0.44
OPRM1 P35372 1/20 0.44
NISCH Q9Y2I1 1/20 0.44
KDM4E B2RXH2 2/20 0.44
POLB P06746 1/20 0.44
CYP2C19 P33261 2/20 0.43
CYP3A4 P08684 1/20 0.43
GAA P10253 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11302002 0.81 EGFR (0.40) ALDH1A1TAAR1GAAHPGDSMN1; SMN2
SCHEMBL11292728 0.79 GPR84 (0.38) ADRA2AADRA2BADRA2CADRA1AADRA1D
SCHEMBL10957691 0.79 AR (0.38) ADRA2AADRA2BADRA2CCYP3A4
SCHEMBL3359983 0.78 ADRA2A (0.52) ADRA2AADRA2BADRA2CADRA1AADRA1D
SCHEMBL31305430 0.78 ADRA2A (0.52) ADRA2AADRA2BADRA2CADRA1AADRA1D
SCHEMBL3428437 0.76 ADRA2A (0.47) ADRA2AADRA2BADRA2CADRA1AADRA1D
SCHEMBL316101 0.75 TAAR1 (0.48) TAAR1POLBGAA
SCHEMBL415584 0.75 ADRA2A (0.53) ADRA2AADRA2BADRA2CADRA1AADRA1D
SCHEMBL31305553 0.75 ADRA2A (0.49) ADRA2AADRA2BADRA2CADRA1AADRA1D
SCHEMBL26113883 0.75 ADRA2A (0.49) ADRA2AADRA2BADRA2CADRA1AADRA1D

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111922553-A Copper surface protective agent for advanced wafer packaging field and preparation method thereof 深圳市创智成功科技有限公司 2020-11-13 CN claimed
CN-107971655-B High-heat-resistance organic solder flux and application thereof 永星化工(上海)有限公司 2019-12-27 CN claimed
CN-107971655-A A kind of high heat-resistance organic solder ability preservative and its application 永星化工(上海)有限公司 2018-05-01 CN claimed
CN-101697662-B High heat-resistance organic solder ability preservative SHENZHEN VITAL NEW MATERIAL CO LTD 2011-04-27 CN claimed
CN-101697662-A High heat-resistance organic solder ability preservative SHENZHEN DEV ARVATO DUAL CHEMI 2010-04-21 CN claimed
CN-111922553-A Copper surface protective agent for advanced wafer packaging field and preparation method thereof 深圳市创智成功科技有限公司 2020-11-13 CN disclosed
CN-107971655-B High-heat-resistance organic solder flux and application thereof 永星化工(上海)有限公司 2019-12-27 CN disclosed
CN-107971655-A A kind of high heat-resistance organic solder ability preservative and its application 永星化工(上海)有限公司 2018-05-01 CN disclosed
EP-1886759-B1 WATER-SOLUBLE PREFLUX AND USE THEREOF SHIKOKU CHEM (JP) 2016-10-05 EP disclosed
CN-101697662-B High heat-resistance organic solder ability preservative SHENZHEN VITAL NEW MATERIAL CO LTD 2011-04-27 CN disclosed
US-7754105-B2 Water-soluble preflux and usage of the same SHIKOKU CHEMICALS CORPORATION (JP) 2010-07-13 US disclosed
CN-101228000-B Water-soluble preflux and use thereof SHIKOKU CHEM 2010-06-09 CN disclosed
CN-101697662-A High heat-resistance organic solder ability preservative SHENZHEN DEV ARVATO DUAL CHEMI 2010-04-21 CN disclosed
US-20080318070-A1 Water-Soluble Preflux and Usage of the Same SHIKOKU CHEMICALS CORPORATION (JP) 2008-12-25 US disclosed
CN-101228000-A Water-soluble preflux and use thereof SHIKOKU CHEM (JP) 2008-07-23 CN disclosed
EP-1886759-A1 WATER-SOLUBLE PREFLUX AND USE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2008-02-13 EP disclosed