SCHEMBL2943501

SCHEMBL2943501

Cc1nc(Cc2ccccc2)c(Cc2ccccc2)[nH]1

nearest known ligand 0.62

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LTB4R Q15722 2/20 0.62
GAA P10253 2/20 0.44
HPGD P15428 3/20 0.44
HSD17B10 Q99714 2/20 0.44
ALDH1A1 P00352 2/20 0.44
KDM4E B2RXH2 2/20 0.44
HTT P42858 1/20 0.44
LMNA P02545 1/20 0.41
CYP2C9 P11712 1/20 0.41
KMT2A Q03164 1/20 0.41
CALM1 P0DP23 1/20 0.41
DAO P14920 1/20 0.40
NR1H2 P55055 1/20 0.40
NR1H3 Q13133 1/20 0.40
PDE3B Q13370 1/20 0.39
PDE3A Q14432 1/20 0.39
NPC1 O15118 1/20 0.39
POLB P06746 1/20 0.39
RAB9A P51151 1/20 0.39
SMN1; SMN2 Q16637 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL28305301 0.98 LTB4R (0.61) LTB4RGAAHPGDHSD17B10ALDH1A1
SCHEMBL11121501 0.90 LTB4R (0.51) LTB4RGAAHPGDHSD17B10ALDH1A1
SCHEMBL28647090 0.87 LTB4R (0.49) LTB4RGAAHPGDHSD17B10ALDH1A1
SCHEMBL14511636 0.84 LTB4R (0.46) LTB4RGAAHPGDHSD17B10ALDH1A1
SCHEMBL15515881 0.83 LTB4R (0.47) LTB4RGAAHPGDHSD17B10ALDH1A1
SCHEMBL8110738 0.80 LTB4R (0.42) LTB4RALDH1A1KDM4E
SCHEMBL11116236 0.79 LTB4R (0.44) LTB4RGAAHSD17B10ALDH1A1LMNA
SCHEMBL6820910 0.79 LTB4R (0.44) LTB4RGAAHPGDHSD17B10ALDH1A1
SCHEMBL7852268 0.79 CAPN1 (0.47) LTB4RGAAHPGDHSD17B10HTT
SCHEMBL6552425 0.77 LTB4R (0.57) LTB4RGAAHPGDHSD17B10ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111922553-A Copper surface protective agent for advanced wafer packaging field and preparation method thereof 深圳市创智成功科技有限公司 2020-11-13 CN claimed
CN-107971655-B High-heat-resistance organic solder flux and application thereof 永星化工(上海)有限公司 2019-12-27 CN claimed
CN-107971655-A A kind of high heat-resistance organic solder ability preservative and its application 永星化工(上海)有限公司 2018-05-01 CN claimed
CN-101697662-B High heat-resistance organic solder ability preservative SHENZHEN VITAL NEW MATERIAL CO LTD 2011-04-27 CN claimed
CN-101697662-A High heat-resistance organic solder ability preservative SHENZHEN DEV ARVATO DUAL CHEMI 2010-04-21 CN claimed
CN-111922553-A Copper surface protective agent for advanced wafer packaging field and preparation method thereof 深圳市创智成功科技有限公司 2020-11-13 CN disclosed
CN-107971655-B High-heat-resistance organic solder flux and application thereof 永星化工(上海)有限公司 2019-12-27 CN disclosed
CN-107971655-A A kind of high heat-resistance organic solder ability preservative and its application 永星化工(上海)有限公司 2018-05-01 CN disclosed
EP-1886759-B1 WATER-SOLUBLE PREFLUX AND USE THEREOF SHIKOKU CHEM (JP) 2016-10-05 EP disclosed
US-9029449-B2 Polymeric composition comprising metal alkoxide condensation product, organic silane compound and boron compound NITTO BOSEKI CO., LTD. (JP) 2015-05-12 US disclosed
EP-2072582-B1 POLYMERIC COMPOSITION COMPRISING METAL ALKOXIDE CONDENSATION PRODUCT, ORGANIC SILANE COMPOUND AND BORON COMPOUND NITTO BOSEKI CO LTD (JP) 2011-12-07 EP disclosed
CN-101522809-B Polymer composition containing metal alkoxide condensation product, organosilane compound and boron compound NITTO BOSEKI CO LTD 2011-10-26 CN disclosed
CN-101228000-B Water-soluble preflux and use thereof SHIKOKU CHEM 2010-06-09 CN disclosed
CN-101697662-A High heat-resistance organic solder ability preservative SHENZHEN DEV ARVATO DUAL CHEMI 2010-04-21 CN disclosed
US-20090252970-A1 POLYMERIC COMPOSITION COMPRISING METAL ALKOXIDE CONDENSATION PRODUCT, ORGANIC SILANE COMPOUND AND BORON COMPOUND NITTO BOSEKI CO., LTD. (JP) 2009-10-08 US disclosed
CN-101522809-A Polymer composition containing metal alkoxide condensation product, organosilane compound and boron compound NITTO BOSEKI CO LTD (JP) 2009-09-02 CN disclosed
EP-2072582-A1 POLYMERIC COMPOSITION COMPRISING METAL ALKOXIDE CONDENSATION PRODUCT, ORGANIC SILANE COMPOUND AND BORON COMPOUND Nitto Boseki CO., LTD. (JP) 2009-06-24 EP disclosed
US-20080318070-A1 Water-Soluble Preflux and Usage of the Same SHIKOKU CHEMICALS CORPORATION (JP) 2008-12-25 US disclosed
CN-101228000-A Water-soluble preflux and use thereof SHIKOKU CHEM (JP) 2008-07-23 CN disclosed
EP-1886759-A1 WATER-SOLUBLE PREFLUX AND USE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2008-02-13 EP disclosed