SCHEMBL29441966

SCHEMBL29441966

CC(C)(c1ccccc1Oc1ccc(C(=O)O)c(C(=O)O)c1)c1ccccc1Oc1ccc(C(=O)O)c(C(=O)O)c1

nearest known ligand 0.52

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
POLB P06746 2/20 0.52
PYGM P11217 12/20 0.50
PYGL P06737 11/20 0.50
KDM4E B2RXH2 1/20 0.48
ALDH1A1 P00352 1/20 0.47
HPSE Q9Y251 1/20 0.46
TDP1 Q9NUW8 3/20 0.46
DUSP3 P51452 1/20 0.46
PTPN5 P54829 1/20 0.46
PTPN11 Q06124 1/20 0.46
LMNA P02545 1/20 0.45
GALK1 P51570 1/20 0.44
CASP6 P55212 1/20 0.44
MCL1 Q07820 1/20 0.44
PLEC Q15149 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL310396 1.00 POLB (0.52) POLBPYGMPYGLKDM4EALDH1A1
SCHEMBL31625580 0.99 POLB (0.51) POLBPYGMPYGLKDM4EALDH1A1
SCHEMBL29664286 0.84 POLB (0.65) POLBPYGMPYGLKDM4EALDH1A1
SCHEMBL7969637 0.84 POLB (0.65) POLBPYGMPYGLKDM4EALDH1A1
SCHEMBL721512 0.83 POLB (0.50) POLBPYGMPYGLKDM4EALDH1A1
SCHEMBL28650646 0.82 POLB (0.63) POLBPYGMPYGLKDM4EALDH1A1
SCHEMBL28891958 0.82 POLB (0.48) POLBPYGMPYGLKDM4EALDH1A1
SCHEMBL6891584 0.81 POLB (0.66) POLBPYGMPYGLKDM4EALDH1A1
SCHEMBL28634306 0.81 POLB (0.61) POLBPYGMPYGLKDM4EALDH1A1
SCHEMBL7965762 0.81 POLB (0.50) POLBPYGMPYGLKDM4EALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025121785-A1 POLYIMIDE PRECURSOR COMPRISING ECO-FRIENDLY SOLVENT AND POLYIMIDE FILM HAVING EXCELLENT SUBSTRATE ADHESION AND EXCELLENT HEAT RESISTANCE CHARACTERISTICS MANUFACTURED THEREFROM 피아이첨단소재 주식회사 2025-06-12 WO claimed
WO-2025089699-A1 POLYIMIDE FILM HAVING IMPROVED BREAKDOWN CHARACTERISTICS AND METHOD FOR MANUFACTURING SAME 피아이첨단소재 주식회사 2025-05-01 WO claimed
US-20250002753-A1 POLYIMIDE VARNISH WITH IMPROVED PULSE ENDURANCE AND POLYIMIDE COATING MATERIAL PREPARED THEREFROM PI ADVANCED MATERIALS CO., LTD. (KR) 2025-01-02 US claimed
CN-118984847-A Polyimide powder preparation method and polyimide powder polyimide powder prepared by the method 聚酰亚胺先端材料有限公司 2024-11-19 CN claimed
WO-2024005508-A1 SELF-LUBRICATING POLYIMIDE VARNISH AND POLYIMIDE COATING PREPARED THEREFROM 피아이첨단소재 주식회사 2024-01-04 WO claimed
CN-122094833-A Multilayer polyimide film and polyimide metal laminate 2026-05-26 CN disclosed
WO-2025121785-A1 POLYIMIDE PRECURSOR COMPRISING ECO-FRIENDLY SOLVENT AND POLYIMIDE FILM HAVING EXCELLENT SUBSTRATE ADHESION AND EXCELLENT HEAT RESISTANCE CHARACTERISTICS MANUFACTURED THEREFROM 피아이첨단소재 주식회사 2025-06-12 WO disclosed
WO-2025089699-A1 POLYIMIDE FILM HAVING IMPROVED BREAKDOWN CHARACTERISTICS AND METHOD FOR MANUFACTURING SAME 피아이첨단소재 주식회사 2025-05-01 WO disclosed
US-20250074041-A1 FILM, LAMINATE, WIRING BOARD, LAMINATED WIRING BOARD, AND MANUFACTURING METHOD OF LAMINATED WIRING BOARD FUJIFILM CORPORATION (JP) 2025-03-06 US disclosed
US-20250002753-A1 POLYIMIDE VARNISH WITH IMPROVED PULSE ENDURANCE AND POLYIMIDE COATING MATERIAL PREPARED THEREFROM PI ADVANCED MATERIALS CO., LTD. (KR) 2025-01-02 US disclosed
CN-118984847-A Polyimide powder preparation method and polyimide powder polyimide powder prepared by the method 聚酰亚胺先端材料有限公司 2024-11-19 CN disclosed
US-20240352193-A1 POLYAMIC ACID AQUEOUS SOLUTION COMPOSITION KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY (KR) 2024-10-24 US disclosed
WO-2022114938-A1 POLYIMIDE FILM HAVING HIGH DIMENSIONAL STABILITY AND MANUFACTURING METHOD THEREFOR 피아이첨단소재 주식회사 2022-06-02 WO disclosed
WO-2022107968-A1 POLYAMIC ACID COMPOSITION, AND POLYIMIDE COMPRISING SAME 주식회사 피아이첨단소재 2022-05-27 WO disclosed
WO-2022107967-A1 POLYAMIC ACID COMPOSITION, AND POLYIMIDE COMPRISING SAME 주식회사 피아이첨단소재 2022-05-27 WO disclosed
WO-2022107965-A1 POLYAMIC ACID COMPOSITION, AND POLYIMIDE COMPRISING SAME 주식회사 피아이첨단소재 2022-05-27 WO disclosed
WO-2022107969-A1 POLYAMIC ACID COMPOSITION, AND POLYIMIDE COMPRISING SAME 주식회사 피아이첨단소재 2022-05-27 WO disclosed
WO-2022107966-A1 POLYAMIC ACID COMPOSITION, AND POLYIMIDE COMPRISING SAME 주식회사 피아이첨단소재 2022-05-27 WO disclosed
EP-3988914-A1 TACTILE SENSOR FORMED ON POLYIMIDE THIN FILM HAVING HIGH TOTAL LIGHT TRANSMITTANCE, AND SWITCHING DEVICE USING SAME Mitsui Chemicals, Inc. (JP) 2022-04-27 EP disclosed
WO-2022071443-A1 POLYAMIDIMIDE COPOLYMER AND FILM WHICH USES SAME 太陽ホールディングス株式会社 2022-04-07 WO disclosed