SCHEMBL310396

SCHEMBL310396

CC(C)(c1ccccc1Oc1ccc(C(=O)O)c(C(=O)O)c1)c1ccccc1Oc1ccc(C(=O)O)c(C(=O)O)c1

nearest known ligand 0.52

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
POLB P06746 2/20 0.52
PYGM P11217 12/20 0.50
PYGL P06737 11/20 0.50
KDM4E B2RXH2 1/20 0.48
ALDH1A1 P00352 1/20 0.47
HPSE Q9Y251 1/20 0.46
TDP1 Q9NUW8 3/20 0.46
DUSP3 P51452 1/20 0.46
PTPN5 P54829 1/20 0.46
PTPN11 Q06124 1/20 0.46
LMNA P02545 1/20 0.45
GALK1 P51570 1/20 0.44
CASP6 P55212 1/20 0.44
MCL1 Q07820 1/20 0.44
PLEC Q15149 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29441966 1.00 POLB (0.52) POLBPYGMPYGLKDM4EALDH1A1
SCHEMBL31625580 0.99 POLB (0.51) POLBPYGMPYGLKDM4EALDH1A1
SCHEMBL29664286 0.84 POLB (0.65) POLBPYGMPYGLKDM4EALDH1A1
SCHEMBL7969637 0.84 POLB (0.65) POLBPYGMPYGLKDM4EALDH1A1
SCHEMBL721512 0.83 POLB (0.50) POLBPYGMPYGLKDM4EALDH1A1
SCHEMBL28650646 0.82 POLB (0.63) POLBPYGMPYGLKDM4EALDH1A1
SCHEMBL28891958 0.82 POLB (0.48) POLBPYGMPYGLKDM4EALDH1A1
SCHEMBL6891584 0.81 POLB (0.66) POLBPYGMPYGLKDM4EALDH1A1
SCHEMBL28634306 0.81 POLB (0.61) POLBPYGMPYGLKDM4EALDH1A1
SCHEMBL7965762 0.81 POLB (0.50) POLBPYGMPYGLKDM4EALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 459 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260132262-A1 BLACK POLYIMIDE FILM AND THE MANUFACTURING METHOD THEREOF PI ADVANCED MAT CO LTD (KR) 2026-05-14 US claimed
US-20260132256-A1 POLYAMIC ACID COMPOSITION AND POLYIMIDE PREPARED WITH THE SAME PI ADVANCED MAT CO LTD (KR) 2026-05-14 US claimed
US-20260125577-A1 SELF-LUBRICATING POLYIMIDE VARNISH AND POLYIMIDE COATING PREPARED THEREFROM PI ADVANCED MAT CO LTD (KR) 2026-05-07 US claimed
US-20260092194-A1 POLYIMIDE VARNISH WITH IMPROVED PULSE ENDURANCE AND POLYIMIDE COATING MATERIAL PREPARED THEREOF PI ADVANCED MAT CO LTD (KR) 2026-04-02 US claimed
US-12522704-B2 Polyimide film having high dimensional stability and manufacturing method therefor PI ADVANCED MATERIALS CO., LTD. (KR) 2026-01-13 US claimed
US-20260008935-A1 POLYIMIDE FILM AND MANUFACTURING METHOD THEREFOR PL ADVANCED MAT CO LTD (KR) 2026-01-08 US claimed
EP-4626991-A1 POLYIMIDE VARNISH FOR COATING CONDUCTOR WITH IMPROVED HEAT DISSIPATION FOR COATING CONDUCTOR AND POLYIMIDE COATING MATERIAL COMPRISING THE SAME PI Advanced Materials Co., Ltd. (KR) 2025-10-08 EP claimed
US-20250230282-A1 MANUFACTURING METHOD OF POLYIMIDE POWDER AND POLYIMIDE POWDER MANUFACTURED BY THE SAME PI ADVANCED MAT CO LTD (KR) 2025-07-17 US claimed
EP-4553121-A1 SELF-LUBRICATING POLYIMIDE VARNISH AND POLYIMIDE COATING PREPARED THEREFROM PI Advanced Materials Co., Ltd. (KR) 2025-05-14 EP claimed
US-20250075100-A1 POLYIMIDE VARNISH WITH IMPROVED PULSE ENDURANCE AND POLYIMIDE COATING MATERIAL PREPARED THEREOF PI ADVANCED MATERIALS CO., LTD. (KR) 2025-03-06 US claimed
CN-111295411-A Polyimide film with improved surface quality and method for preparing the same 韩国爱思开希可隆PI股份有限公司 2020-06-16 CN claimed
CN-111286053-A High-modulus low-thermal-expansion-coefficient polyimide multilayer composite film and preparation method and application thereof 中国科学院化学研究所 2020-06-16 CN claimed
WO-2020054912-A1 POLYIMIDE FILM HAVING IMPROVED SURFACE QUALITY AND METHOD FOR MANUFACTURING SAME 에스케이씨코오롱피아이 주식회사 2020-03-19 WO claimed
WO-2020017692-A1 POLYIMIDE FILM COMPRISING CLAY PARTICLES AND CARBON BLACK AND MANUFACTURING METHOD THEREFOR 에스케이씨코오롱피아이 주식회사 2020-01-23 WO claimed
WO-2020017697-A1 POLYIMIDE FILM INCLUDING FLUORINE-CONTAINING SILANE ADDITIVE AND CARBON BLACK, AND METHOD FOR PRODUCING SAME 에스케이씨코오롱피아이 주식회사 2020-01-23 WO claimed
EP-1000108-B1 AQUEOUS POLYIMIDE PROCESS COMMW SCIENT IND RES ORG (AU) 2005-01-05 EP claimed
US-5552222-A THERMOPLASTIC INSULATION FOR TURBINE GENERATOR GENERAL ELECTRIC COMPANY (US) 1996-09-03 US claimed
US-5189115-A Blend of 2,2-bis(3',4'-dicarboxyphenyl)propane dianhydride, an aromatic bis(ether anhydride) and a diamine AMOCO CORPORATION (US) 1993-02-23 US claimed
US-4374972-A ELECTRIC INSULATION GENERAL ELECTRIC COMPANY (US) 1983-02-22 US claimed
US-4360633-A Coating solution of polyetherimide oligomers GENERAL ELECTRIC COMPANY (US) 1982-11-23 US claimed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260132262-A1 BLACK POLYIMIDE FILM AND THE MANUFACTURING METHOD THEREOF PARG, PARN, DYNC1LI1 POLB 2367/4885PYGM 2273/4885PYGL 2753/4885
US-20260092194-A1 POLYIMIDE VARNISH WITH IMPROVED PULSE ENDURANCE AND POLYIMIDE COATING MATERIAL PREPARED THEREOF SMURF1, TET1, VCL POLB 1316/4885PYGM 279/4885PYGL 3114/4885
US-20260125577-A1 SELF-LUBRICATING POLYIMIDE VARNISH AND POLYIMIDE COATING PREPARED THEREFROM CDH1, PBRM1, ITGA1 POLB 2710/4885PYGM 4223/4885PYGL 4568/4885
US-20260008935-A1 POLYIMIDE FILM AND MANUFACTURING METHOD THEREFOR MALT1, CDH1, TET1 POLB 3128/4885PYGM 3734/4885PYGL 4341/4885
US-20260132256-A1 POLYAMIC ACID COMPOSITION AND POLYIMIDE PREPARED WITH THE SAME PARG, PARN, PUF60 POLB 2517/4885PYGM 3240/4885PYGL 4764/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.