SCHEMBL29447173

SCHEMBL29447173

C=CCNN(CCC)NCC=C

nearest known ligand 0.35

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.35
FAAH O00519 1/20 0.32
ALDH1A1 P00352 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30689684 0.81 MEN1 (0.33) TSHR
SCHEMBL11617998 0.79 TSHR (0.35) TSHRFAAHALDH1A1
SCHEMBL16654852 0.72
SCHEMBL3674964 0.72
SCHEMBL19209905 0.71 DNM1 (0.30)
SCHEMBL9423866 0.70 FAAH (0.42) TSHRFAAHALDH1A1
SCHEMBL1602541 0.69
SCHEMBL10938180 0.69
SCHEMBL19072115 0.68
Hydrochloric Acid SCHEMBL11498329 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118679204-A Curing agent and adhesive for epoxy resin 盛势达技研株式会社 2024-09-20 CN disclosed
CN-117043221-A Curable composition, cured product, fiber-reinforced composite material, and fiber-reinforced resin molded article DIC株式会社 2023-11-10 CN disclosed
WO-2023074450-A1 CLATHRATE COMPOUND, EPOXY RESIN CURING AGENT, AND CURABLE RESIN COMPOSITION 株式会社ADEKA 2023-05-04 WO disclosed
CN-115003709-A Compound, method for producing compound, and curable composition 株式会社艾迪科 2022-09-02 CN disclosed
WO-2022168666-A1 CURABLE RESIN COMPOSITION 株式会社ADEKA 2022-08-11 WO disclosed
WO-2022168665-A1 NOVEL COMPOUND, AND CURABLE RESIN COMPOSITION CONTAINING SAID COMPOUND 株式会社ADEKA 2022-08-11 WO disclosed
WO-2022168670-A1 CHARGE TRANSFER COMPLEX 株式会社ADEKA 2022-08-11 WO disclosed
CN-114207039-A Curable resin composition 株式会社艾迪科 2022-03-18 CN disclosed