SCHEMBL29488291

SCHEMBL29488291

CC(C)(C)c1ccc(-c2c3ccccc3nc3ccccc23)cc1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TNKS O95271 2/20 0.56
TNKS2 Q9H2K2 2/20 0.56
TP53 P04637 3/20 0.52
SMN1; SMN2 Q16637 3/20 0.52
ESR1 P03372 4/20 0.51
ESR2 Q92731 3/20 0.51
HDAC6 Q9UBN7 1/20 0.50
TNF P01375 1/20 0.50
NOD1 Q9Y239 1/20 0.50
ABCG2 Q9UNQ0 1/20 0.50
MEN1 O00255 2/20 0.48
KMT2A Q03164 2/20 0.48
RAB9A P51151 1/20 0.48
CNR1 P21554 1/20 0.46
CNR2 P34972 1/20 0.46
GPR55 Q9Y2T6 1/20 0.46
ATM Q13315 1/20 0.46
AKT1 P31749 1/20 0.45
AKT2 P31751 1/20 0.45
GPR84 Q9NQS5 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL601648 1.00 TNKS (0.56) TNKSTNKS2TP53SMN1; SMN2ESR1
SCHEMBL14278928 0.87 ESR1 (0.53) TNKSTNKS2TP53SMN1; SMN2ESR1
SCHEMBL28364734 0.86 ESR1 (0.58) TNKSTNKS2TP53SMN1; SMN2ESR1
SCHEMBL30662421 0.84 TNKS (0.46) TNKSTNKS2TP53SMN1; SMN2HDAC6
SCHEMBL22978415 0.84 TNKS (0.46) TNKSTNKS2TP53SMN1; SMN2HDAC6
SCHEMBL5955995 0.84 KIF11 (0.46) TNKSTNKS2TP53SMN1; SMN2HDAC6
SCHEMBL30956247 0.84 ESR1 (0.50) TNKSTNKS2TP53SMN1; SMN2ESR1
SCHEMBL29274260 0.84 ESR1 (0.50) TNKSTNKS2TP53SMN1; SMN2ESR1
SCHEMBL600986 0.81 ABCG2 (0.53) TNKSTNKS2TP53SMN1; SMN2ESR1
SCHEMBL29488281 0.81 ABCG2 (0.53) TNKSTNKS2TP53SMN1; SMN2ESR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110357989-B Tertiary amine photosensitizer, preparation method thereof, photosensitive resin composition containing tertiary amine photosensitizer and application of photosensitive resin composition 常州强力电子新材料股份有限公司 2022-04-22 CN claimed
CN-120044756-A Photosensitive resin composition 旭化成株式会社 2025-05-27 CN disclosed
CN-115524922-B Photosensitive resin composition 旭化成株式会社 2025-02-18 CN disclosed
CN-118119565-A Structure having micro-channel, method for manufacturing same, and micro-channel device 旭化成株式会社 2024-05-31 CN disclosed
CN-116981999-A Photosensitive resin laminate and method for producing same 旭化成株式会社 2023-10-31 CN disclosed
CN-111315828-B Composition, cured product, optical filter, and method for producing cured product 株式会社艾迪科 2023-09-29 CN disclosed
CN-112154167-B Composition, cured product, optical filter, and method for producing cured product 株式会社艾迪科 2023-08-22 CN disclosed
CN-111527450-B Photosensitive resin laminate and method for producing same 旭化成株式会社 2023-08-08 CN disclosed
CN-111596526-B Photosensitive resin composition and photosensitive resin laminate 旭化成株式会社 2023-07-25 CN disclosed
CN-116348294-A Photosensitive resin laminate 旭化成株式会社 2023-06-27 CN disclosed
WO-2023068276-A1 STRUCTURE COMPRISING MICROCHANNEL, PRODUCTION METHOD FOR SAID STRUCTURE, AND MICROCHANNEL DEVICE 旭化成株式会社 2023-04-27 WO disclosed
CN-115524922-A Photosensitive resin composition 旭化成株式会社 2022-12-27 CN disclosed
CN-110325913-B Photosensitive resin composition 旭化成株式会社 2022-11-01 CN disclosed
CN-115047714-A Resist composition and laminate thereof 杭州福斯特电子材料有限公司 2022-09-13 CN disclosed
WO-2022186389-A1 PHOTOSENSITIVE RESIN MULTILAYER BODY AND METHOD FOR PRODUCING SAME 旭化成株式会社 2022-09-09 WO disclosed
CN-114667487-A Photosensitive resin composition and photosensitive resin laminate 旭化成株式会社 2022-06-24 CN disclosed
CN-110114376-B Curable composition, method for producing cured product, cured product thereof, and adhesive using same 株式会社ADEKA 2022-06-14 CN disclosed
WO-2022085366-A1 PHOTOSENSITIVE RESIN MULTILAYER BODY 旭化成株式会社 2022-04-28 WO disclosed
CN-110357989-B Tertiary amine photosensitizer, preparation method thereof, photosensitive resin composition containing tertiary amine photosensitizer and application of photosensitive resin composition 常州强力电子新材料股份有限公司 2022-04-22 CN disclosed
CN-114296315-A Photosensitive resin composition 旭化成株式会社 2022-04-08 CN disclosed